CEM-1 Copper clad laminate
15.0~18.0 USD
| Min. Order: | 100 Piece/Pieces |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | L/C, D/P, T/T, WU |
| Supply Ability: | 15000pcs one month |
| Place of Origin: | Zhejiang |
Company Profile
| Location: | Ningbo, Zhejiang, China (Mainland) |
|---|---|
| Business Type: | Manufacturer, Trading Company |
| Main Products: | Electrical Insulation Laminate Sheet, Copper Clad Laminate, PCB Used Insulation Sheet |
Product Detail
| Model No.: | CEM1 |
|---|---|
| Means of Transport: | Ocean |
| Peel strength min 1.2 N/mm: | Bubble test after heat punching 0 bubble |
| Production Capacity: | 15000pcs one month |
| Packing: | case and pallet |
| Delivery Date: | 20 days |
Product Description
CEM1 copper clad laminate is composite of epoxy resin, glass cloth and paper as based material, then
covered with copper foil. It is of heat resistant, excellent dimensional stability after heating, good mechanical
& electrical properties, high peel strength and chemical resistant, Suitable for making flame resistant PCB of high grade electronic equipment and auto-instrument line.
covered with copper foil. It is of heat resistant, excellent dimensional stability after heating, good mechanical
& electrical properties, high peel strength and chemical resistant, Suitable for making flame resistant PCB of high grade electronic equipment and auto-instrument line.
Peel strength Soldering 10s explored in solent vapour At 100℃ : min 1.2 N/mm
Bubble test after heat punching260℃: Not be divided no bubble
Punch ability AT 70℃- 80℃: excellent
Flammability UL94 :FVO
| General Properties | |||
| TestItem | Unit | Condition | TypicalValue |
| CEM-1CCL | |||
| Surfaceresistivity(min) | MΩ | Afterconstantdamp-hottreatmentAT100℃ | 30000 1000 |
| Volumeresistivity(min) | MΩ.m | Afterconstantdamp-hottreatmentAT100℃ | 5000 100 |
| DielectricConstant(min) | Afterconstantdamp-hottreatment | 5.2 | |
| DissipationFactor(max) | Afterconstantdamp-hottreatment | 0.045 | |
| PullStrength(min) | N | 60 | |
| PeelStrength(min) | N/mm | Soldering10sexploredinsolentvapourAt100℃ | 1.2 1.2 0.6 |
