Aluminum base copper clad laminate pcb board
0.1~0.5 USD
| Min. Order: | 5 Piece/Pieces |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | T/T, WU |
| Supply Ability: | 300000 Square Meter/Square Meters / Month |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | PCB |
Product Detail
| Means of Transport: | Ocean, Air, Land |
|---|---|
| Number of Layers: | 4-Layer |
| Brand Name: | tws |
| Base Material: | fr4 |
| Copper Thickness: | 1oz |
| Board Thickness: | 1.6mm |
| Min. Hole Size: | 0.15mm |
| Min. Line Width: | 0.2mm |
| Min. Line Spacing: | 0.2mm |
| Surface finishing: | HASL&ENIG |
| Solder mask: | Green/Blue/Black/White/Yellow/Red etc |
| Max size of finish board: | 9200*900mm |
| Certification: | UL/SGS/ROHS |
| Controlled impedance: | ±5% |
| Warp&Twist: | 0.7% |
| Rang of finish boards thickness: | 0.21~7.0mm |
| Layer count: | 1~28 |
| OEM/ODM: | One-stop service |
| PCB standard: | IPC-A-610D |
| Production Capacity: | 300000 Square Meter/Square Meters / Month |
| Packing: | vacuum package+carton box |
| Delivery Date: | 10-15 working days for mass pcb order. |
Product Description
aluminum base copper clad laminate
Our Advantages:
- aluminum base copper clad laminate
- 10 years factory experience
- Provide PCB &PCBA prototype, and medium&low volume quick board services.
- One-hour quote response, 24 hours quick-turn produce
- Components purchasing, SMT/PCBA one-stop source
- ISO 9001,UL RoHs, SGS certificate
One-stop Service:
- PCB / FPC/ PCBA Copy
- PCB drawing / design according to schematic diagram
- PCB manufacturing
- Component sourcing
- PCB Assembly
- PCBA test
Products using range:
Our products are widely used in communication apparatus, automobile electronics, computers, medical devices and network devices and consumer electronics class fields.
Item | Manufacture Capability | |
Material | FR-4 / Hi Tg FR-4 / Taconic / Rogers / F4BK /CEM-3 / Aluminium / other Metal based | |
Layer No. | 1-20 | |
Finished Board thickness | 0.2 mm-3.8mm'(8 mil-150 mil) | |
Board Thickness Tolerance | ±10% | |
Cooper thickness | 0.5 OZ-11OZ (18 um-385 um) | |
Copper Plating Hole | 18-40 um | |
Impedance Control | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | |
Images | ||
Min Trace Width (a) | 0.1mm (4 mil) | |
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) | |
SMD Pitch (a) | 0.2 mm(8 mil) | |
BGA Pitch (b) | 0.2 mm (8 mil) | |
Solder Mask | ||
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) | |
Soldermask Clearance (b) | 0.1mm (4 mil) | |
Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Hole size (CNC) | 0.2 mm (8 mil) | |
Min Punch Hole Size | 0.9 mm (35 mil) | |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | |
Hole Position Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-5u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
Gold Finger angle | 15° 30° 45° 60° | |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate | |
ALUMINUM BASE COPPER CLAD LAMINATE