Copper clad laminate sheet CEM-3

15.0~20.0 USD

Min. Order:	200 Piece/Pieces
Trade Term:	FOB
Payment Terms:	L/C, T/T
Supply Ability:	500000 per month
Place of Origin:	Zhejiang

Company Profile

Hangzhou Liansheng Insulation Co.,Ltd

Location:	Hangzhou, Zhejiang, China (Mainland)
Business Type:	Manufacturer
Main Products:	Copper Clad Laminate, GPO-3, G11, G10, FR4 Material

Product Detail

Model No.:	LS
Means of Transport:	Ocean
Place of Origin:	Zhejiang China (Mainland)
Brand Name:	LESON
Model Number:	CEM-3
Flammability:	UL 94 V-0
Material:	epoxy fiberglass with copper foil
Spot goods size(width and length):	1040X1240mm(41"X49")
Thickness:	0.5mm to 3.2mm
Thickness of copper foil:	18 micron,35 micron single side&double
Color:	Natural(Aqua green),yellow,black
Application:	PCB
Production Capacity:	500000 per month
Packing:	200 sheets per pallet,wooden pallet
Delivery Date:	10-18 days,according to the quantity of the order

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Product Description

LESON FR4 Copper Clad Laminate is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides. Usually used in PCB with printed circuit on one or both sides of computers, home electric appliances and other lines.

FR4 Copper Clad Laminate
1.Material	composite polymer(flame- retardant epoxy resin, E-glass fiber cloth with copper as cladding
2.Technics	Mixing ,Coating,Folding,Laminated,Return Line,Cutting,Packing
3.Color	natural color(light green ),yellow, and black,or as per customer's requirement
4.Measurement	41"X49",43"X49"(1040*1240mm)
5. Feature:	Lead Free, Flame retardant, thermal reliability, lower warpage,
6.Using scope	Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process, etc.
7.Packing	carton packaging/ 250 sheet per pallet
8. Certification	ISO9001,ISO14001,CQC,UL
9.Payment	T/T,L/C, Western Union ,USD
10. Technological requirements	For your choices

Properities

1.Tg≥170°C(DSC)

2.UV blocking and AOI compatible ,so as to increase productivity efficiency

3.High thermal performance ,Td ≥325°C,T288≥5min,suitable for lead-free process.

4.Good flatness, smooth surface,no pits

Application

Suitable for high-count layer PCB, computer, communication equipment, OA equipment,
lead-free PCB process etc

Technician Data

Item		Test condition	Unit	SPEC	Typical Value
Tg		DSC	°C	≥170	175.2
Peel strength(1OZ)		288°C,10S	N/mm	≥1.05	1.41
Thermal Stress		288°C,10S/solder dip	____	No delamination	180S/ No delamination
Flammability		N/mm²	LW	≥415	580
Flammability		N/mm²	CW	≥345	482
Surface Resistivity		After moisture	MΩ	≥1. 0×10⁴	2,52×10⁷
Volume Resistivity		After moisture	MΩ.cm	≥1.0×10⁵	3.21×10⁸
Dielectric Constant		1MHz C-24/23/50	____	≤5.4	4.7
Loss Tangent		1MHz C-24/23/50	____	≤0.035	0.016
Arc Resistivity		D-48/50+D-0.5/23	S	≥60	122
Dielectric Breakdown		D-48/50+D-0.5/23	KV	≥40	58
Moisture Absorption		D-24/23	%	≤0.5	0.1
Td		Weight loss 5%	°C	340	347
CTE Z—axis	Alpha 1	TMA	ppm/°C	≤60	45
	Alpha 2		ppm/°C	≤300	270
	50-260°C		%	≤3.0	2.9
T288		TMA	min	≥15	30
CTI		IEC60112 Method	V	175~250(Grade 3)	200

Suggestion for use

Please baking the laminate at 150°C,2 hours before using.

Please pay attention to the machining for the interbedded energy is lower than the normal FR-4.Rilling parameters are mainly dependent on hole size ,layer thickness, layer number ,copper thickness and stack height.

The following drilling parameters are for reference only .Typical drilling parameters for 0.4 ~1.0mm drills are as follows:

speed :45 ~105 KRPM

Feed rate:50~150 IPM

Retract rate:;500~1000 IPM

Suggest hit count:1500 HITS

Stack height:≤2pnls(2~6 layers), 1pnls(≤8 layers)

Entry Material:0.2mm Aluminum