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FR4 copper clad laminate sheet

10.0~20.0 USD
Min. Order: 250 Piece/Pieces
Trade Term: FOB
Payment Terms: L/C, T/T
Supply Ability: 500000 per month
Place of Origin: Zhejiang

Company Profile

Location: Hangzhou, Zhejiang, China (Mainland)
Business Type: Manufacturer
Main Products: Copper Clad Laminate, GPO-3, G11, G10, FR4 Material

Product Detail

Model No.: LS
Means of Transport: Ocean
Place of Origin: Zhejiang China (Mainland)
Brand Name: LESON
Model Number: FR4
NEMA standard: EPGC202
Material: epoxy fiberglass with copper foil
Spot goods size(width and length): 1040X1240mm(41"X49")
Thickness: 0.5mm to 3.2mm
Thickness of copper foil: 18 micron,35 micron single side&double
Color: Natural(Aqua green),yellow,black
Production Capacity: 500000 per month
Packing: 250 sheets per pallet,wooden pallet
Delivery Date: 10-18 days,according to the quantity of the order
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Product Description


LESON FR4 copper clad laminateLESON FR4 copper clad laminate

LESON FR4 Copper Clad Laminate is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides. Usually used in PCB with printed circuit on one or both sides of computers, home electric appliances and other lines.

FR4 Copper Clad Laminate

1.Material

composite polymer(flame- retardant epoxy resin, E-glass fiber cloth with copper as cladding

2.Technics

Mixing ,Coating,Folding,Laminated,Return Line,Cutting,Packing

3.Color

natural color(light green ),yellow, and black,or as per customer's requirement

4.Measurement

41"X49",43"X49"(1040*1240mm)  

5. Feature:

Lead Free, Flame retardant, thermal reliability, lower warpage,

6.Using scope

Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process, etc.

7.Packing

carton packaging/ 250 sheet per pallet

8. Certification

ISO9001,ISO14001,CQC,UL

9.Payment

T/T,L/C, Western Union ,USD

10. Technological requirements

For your choices























Properities

1.Tg≥170°C(DSC)

2.UV blocking and AOI compatible ,so as to increase productivity efficiency

3.High thermal performance ,Td ≥325°C,T288≥5min,suitable for lead-free process.

4.Good flatness, smooth surface,no pits

Application

Suitable for high-count layer PCB, computer, communication equipment, OA equipment,
lead-free PCB process etc

Technician Data

  

Item

Test condition

Unit

SPEC

Typical Value

Tg

DSC

°C

≥170

175.2

Peel strength(1OZ)

288°C,10S

N/mm

≥1.05

1.41

Thermal Stress

288°C,10S/solder dip

____

No delamination

180S/ No delamination

Flammability

N/mm2

LW

                         ≥415

580

CW

                         ≥345

482

Surface Resistivity

After moisture

≥1. 0×104

2,52×107

Volume Resistivity

After moisture

MΩ.cm

≥1.0×105

3.21×108

Dielectric Constant

1MHz C-24/23/50

____

≤5.4

4.7

Loss Tangent

1MHz   C-24/23/50

____

≤0.035

0.016

Arc Resistivity

D-48/50+D-0.5/23

S

≥60

122

Dielectric Breakdown

D-48/50+D-0.5/23

KV

≥40

58

Moisture Absorption

D-24/23

%

≤0.5

0.1

Td

Weight loss 5%

°C

340

347

CTE

Z—axis

Alpha 1

TMA

ppm/°C

≤60

45

Alpha 2

ppm/°C

≤300

270

50-260°C

%

≤3.0

2.9

T288

TMA

min

≥15

30

CTI

IEC60112 Method

V

175~250(Grade 3)

        200                                                            

Suggestion for use

Please baking the laminate at 150°C,2 hours before using.

Please pay attention to the machining for the interbedded energy is lower than the normal FR-4.Rilling parameters are mainly dependent on hole size ,layer thickness, layer number ,copper thickness and stack height.

The following drilling parameters are for reference only .Typical drilling parameters for 0.4 ~1.0mm drills are as follows:

speed :45 ~105 KRPM    

Feed rate:50~150 IPM

Retract rate:;500~1000 IPM

Suggest hit count:1500 HITS

Stack height:≤2pnls(2~6 layers), 1pnls(≤8 layers)

Entry Material:0.2mm Aluminum
LESON FR4 copper clad laminate
LESON FR4 copper clad laminate

LESON FR4 copper clad laminate

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