FR2 copper clad laminate is mainly made of wooden paper,phenolic resin.
Their application is PCB for Automatic merchandsing machine,Heater,Kitchen equipment,Measuring machine etc.
Item | Unit | Test Method | Condition | Spec | Typical |
FR2 CCL |
Flammability | ~ | UL94 | UL94 | UL94V-0 | V-0 |
Peel Strength(1oz) | kgf/cm | JIS C6481 | A | ≥1.2 | 1.6~2.0 |
Solder Resistance(260℃) | Sec | JIS C6481 | A | ≥10 | 18~32 |
Flexural Strength | Kgf/mm2 | JIS C6481 | LW | ≥9 | 13~15 |
CW | 11~13 |
Surface Resistance | Adhesive Side | Ω | JIS C6481 | C-96/20/65 | ≥1012 | 1012~1013 |
C-96/20/65+ C-96/40/90 | ≥1011 | 1011~1012 |
Laminate Side | C-96/20/65 | ≥1011 | 1011~1012 |
C-96/20/65+ C-96/40/90 | ≥108 | 109~1011 |
Volume Resistance | Ω.cm | JIS C6481 | C-96/20/65 | ≥5×1010 | 1012~1013 |
C-96/20/65+ C-96/40/90 | ≥5×109 | 1011~1012 |
Insulation Resistance | Ω | JIS C6481 | C-96/20/65 | ≥1011 | 1011~1012 |
C-96/20/65+ D-2/100 | ≥108 | 109~1010 |
Dielectric Constant(1MHz) | ~ | JIS C6481 | C-96/20/65 | ≤5.0 | 4.0~5.0 |
C-96/20/65+ C-96/40/90 | ≤5.3 | 4.5~5.3 |
Dissipation Factor | ~ | JIS C6481 | C-96/20/65 | ≤0.040 | 0.030~0.040 |
C-96/20/65+ C-96/40/90 | ≤0.050 | 0.035~0.048 |
Water Absorption | % | JIS C6481 | E-24/50+ D-24/23 | ≤0.75 | 0.50~0.75 |
Heat Resistance | ~ | JIS C6481 | 130℃ 30min | No change | No change |
Chemical Resistance | ~ | JIS C6481 | 3% NaOH 40℃ 3min | No change | No change |
CTI | V | IEC 112 | 0.1%NH4CL | AABUS | 175 |
Punching Temperature | ~ | HTXY-QA-103 | A | 40~70 | 45~75 |