XPC copper clad laminate
10.0~12.0 USD
| Min. Order: | 100 Piece/Pieces |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | L/C, D/P, T/T, WU |
| Supply Ability: | 15000pcs one month |
| Place of Origin: | Zhejiang |
Company Profile
| Location: | Ningbo, Zhejiang, China (Mainland) |
|---|---|
| Business Type: | Manufacturer, Trading Company |
| Main Products: | Electrical Insulation Laminate Sheet, Copper Clad Laminate, PCB Used Insulation Sheet |
Product Detail
| Model No.: | XPC |
|---|---|
| Means of Transport: | Ocean |
| peel strength: | min 1.0 N/mm |
| Production Capacity: | 15000pcs one month |
| Packing: | case and pallet |
| Delivery Date: | 20 days |
Product Description
XPC copper clad laminate is made of phenolic paper laminated sheet, resin and copper foil. It suitable
for making PCB in average electronic equipment motor toy and communication equipment.
for making PCB in average electronic equipment motor toy and communication equipment.
1,Peel strength Soldering 5s Explored in solvent vapour: min 1.0 N/mm
2,Bubble test after heat punching260℃: Not be divided no bubble
3,Solder Resistance(260℃): 15~30
4,Heat Resistance 130℃30min: no change
2,Bubble test after heat punching260℃: Not be divided no bubble
3,Solder Resistance(260℃): 15~30
4,Heat Resistance 130℃30min: no change
| GeneralProperties | ||||||
| TestItem | Unit | Condition | TestingMethod | specification | Typicalvalue | |
| XPCCCL | ||||||
| SolderResistance(260℃) | Sec | A | JISC6481 | ≥10 | 15~30 | |
| HeatResistance | — | 130℃ 30min | JISC6481 | NoChange | NoChange | |
| PeelStrength (CopperFoil35μm) | kgf/cm | A | JISC6481 | ≥1.2 | 1.2~1.7 | |
| FlexuralStrength | lengthwise | kgf/mm2 | A | JISC6481 | ≥8 | 14~16 13~14 |
| crosswise | ||||||
| VolumeResistivity | Ω-cm | C-96/20/65 C-96/20/65+C-96/40/90 | JISC6481 | 5×109 5×108 | 1×1012~1013 1×1011~1012 | |
| SurfaceResistance | AdhesiveSide | Ω | C-96/20/65 C-96/20/65+C-96/40/90 | JISC6481 | 1×1010 1×109 | 1×1011~1012 1×1010~1011 |
| LaminateSide | 1×109 1×107 | 1×1010~1011 1×109~1010 | ||||
| InsulationResistance | Ω | C-96/20/65 C-96/20/65+D-2/100 | JISC6481 | 1×109 1×106 | 1×1010~1011 1×107~108 | |
| ChemicalResistance | — | 3%NaOH40℃3min | JISC6481 | Nodelamination Non-foaming | ||
| Boildintrichloroethylenefor3min | ||||||
| WaterAbsorption | % | E-24/50+D-45/23 | JISC6481 | ≤2 | 1.0~1.5 | |
| Flammability | Sec | A | UL94 | 94HB | 94HB | |
| DielectricConstant(1MHz) | — | C-96/20/65 C-96/20/65+D-24/23 | JISC6481 | ≤5.5 ≤6.0 | 4.0~5.0 4.5~5.5 | |
| DissipationFactor | — | C-96/20/65 C-96/20/65+D-24/23 | JISC6481 | ≤0.05 ≤0.1 | 0.025~0.035 0.035~0.045 | |
| CTIValue | V | 0.1%NH4CI | IEC112 | ≥150 | 150~200 | |
| PunchingTemperature | ℃ | A | WI-QA-002 | 50~70 | Ambient~70 | |
