aluminum based copper clad laminate
| Place of Origin: | Jiangsu |
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Company Profile
| Location: | Zhuhai, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
Product Detail
| Model No.: | YH-02 |
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Product Description
Thermal Conductivity (W/m.k) | A | 1~2.0 |
Peel Strength (N/mm) | A After thermal stress | ≥1.8 |
Blister Test after Thermal Stress | A After thermal impact | 288℃ 2min |
Flammability | UL94 | V-0 |
Thermal Resistance Max (℃/W) | A | ≤1.0 |
Surface Resistivity (MΩ.m) | A Constant humidity treatment (90%, 35 ℃,96H) | ≥1×105 |
Volume Resistivety (MΩ.m) | A (90%,35 ℃,96H) | ≥1.8×106 |
Dielectric Breakdown Min (KV) | A | ≥2.5 |
Dielectric Constant (1MHz) | (40 ℃,90%,96H) | ≤3 |
Dissipation Factor | (40 ℃,90%,96H) | ≤0.03 |
