Hot Air Reflow solder machine
739.0~760.0 USD
| Min. Order: | 1 Set/Sets |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | T/T, WU, Moneygram |
| Supply Ability: | 500sets/m |
| Place of Origin: | Zhejiang |
Company Profile
| Location: | Hangzhou, Zhejiang, China (Mainland) |
|---|---|
| Business Type: | Manufacturer, Trading Company |
| Main Products: | Hot Air Reflow Soldering Machine, SMT Pick And Place Machine, Reflow Oven, Stencil Printer, Desktop Automatic Chip Mounter |
Product Detail
| Model No.: | T962C |
|---|---|
| Means of Transport: | Ocean, Air |
| Brand Name: | Neoden |
| Length: | 68.4cm |
| Type: | mini type |
| Weight: | 30kg |
| color: | white |
| Effective soldering area: | 400*600mm |
| Process Period: | 1 to 8 min |
| rated power: | 2500W |
| usage: | PCB and BGA reflow solder |
| size: | 684*504*225mm |
| Temperature Range: | 0℃-280℃ |
| Preheating time: | 3 to 5 minutes |
| Control method: | Micro processor |
| Independent cooling zone qty: | 1 |
| Production Capacity: | 500sets/m |
| Packing: | 80*60*33cm |
| Delivery Date: | 3 working days after payment |
Product Description
Reflow SolderMachine T962C
Brief Introdction
Description: the INFRARED IC HEATERT962C is a micro processor controlled reflow-oven.
MainFunction:Soldering.From preheating,thermalsoaking, fixing, drying, and cooling.
Applicablesoldering parts:various SMD and BGAcomponents.
Applicatation: it is suitable forproduct development, and small batch production of enterprises, companies andinstruments.
Work mode:Automatically. The whole soldering process can be completedautomatically.
Features
Largesolder size
The drawer area is 400*600mm; this increases theusage range of this machine drastically, cost saving.
Accurate temperaturecontrol
Output power is up to 2500W.The combination of powerful infrared heating and hot air circulation ensure thetemperature control accuracy and even distribution.
8 types of differentpredefined soldering cycles
Parameters ofeight soldering cycles are predefined and the entire soldering process cancompleted automatically from Preheat, Soak and Reflow through to CoolDown.
Ergonomicdesign
Visuableoperation, friendly operation interface, perfect predefined soldering wavesmakes easy operation.
Small andlightweight body is convenient for transported and stored, costsaving.
The compactbody and small footprint allow the machine be easily bench-positioned, spacesaving.
SufficientFunctions
a.Mainfunction:re-flow solder.
Preheating, thermal soaking,fixing, drying, and quick cooling functions are achievedon this machine.
It cansolder mostsingle-side or both-side PCB boards mounted with small parts, including CHIP,SOP, PLCC, QFP, BGA etc.
b.Otherfunction
Red gluecuring
Thermal aging testof PCB
Rework of the PCB
Paremeters
Powersupply | AC110V/ 50Hz AC220V /60Hz |
Ratedpower | 2500W |
Solderingsize/ Drawersize | 400×600mm |
TemperatureRange | 0°C-280°C |
CycleTime | 1~8min |
Machinesize | 68.4*50.4*22.5cm |
