SMT Reflow Oven/ BGA Solder Reflow Oven/ SMT Reflow Furnace (S8)
1.0 USD
| Min. Order: | 1 Set/Sets |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 100set/month |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
Product Detail
| Model No.: | ETA E8 reflow oven |
|---|---|
| Means of Transport: | Ocean |
| Brand Name: | ETA reflow oven |
| Length: | 4800*1250*1490MM |
| Type: | Reflow oven |
| Weight: | 2900kg |
| color: | computer grey |
| Production Capacity: | 100set/month |
| Packing: | wooden box |
| Delivery Date: | 30days |
Product Description
Main product: Electronic Equipment, SMT Assembly, SMT/SMD Equipment, SMT Pick and Place Machine, SMT Placement Machine, SMT Mounting Machine, PCB Machine, BGA Solder Reflow Oven, SMT reflow solder, SMT equipment
Lead-Free Reflow Soldering Equipment S10
1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.
Lead-Free Reflow Soldering Equipment S10
1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.