Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | 367UYH |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | HT | ModelNumber: | HT-2125 |
Base Material: | PI FR4 | Copper Thickness: | 1/2-2.0 | Board Thickness: | 0.05-3.0mm |
Min. Hole Size: | 0.2mm | Min. Line Width: | 0.05mm | Min. Line Spacing: | 0.05mm |
Surface Finishing: | OSP PlatedTin Plated Ni/gold ENIG Plated Tin Plating |
Packaging Detail: | standard export carton packing or packing according to the customer'srequirement |
Delivery Detail: | 7days |
Flex PCB ProcessCapability | |||
Items | General Process Capability | Material:PI,PET TraceTolerance:±20% Hole diametertolerance:±3mil ShapingProcessing:±0.13mm(special artwork is specialstandard) EtchingTolerance:±0.015mm MoldingTolerance:±0.05mm Copper thickness:18μm,35μm,70μm Reinforce Material:PI, FR4 steel 3M adhensive ,PET | |
Product type | Single Side | ||
Double Side | |||
Hollow board | |||
Multilayer FPC | |||
Rigid-flex board | |||
Layers | 1---6layers | ||
Finished BoardThickness | 0.05mm---2.0mm | ||
Min. holediameter | 0.2mm(CNC)(8mil) | ||
Min laser hole diameter | 0.1mm | ||
Min trace width andSpace | 1/3 OZ | 2.0mil/2.0mil | |
1/2 OZ | 2.5mil/2.5mil | ||
1 OZ | 3.0mil/3.0mil | ||
2OZ | 4.0mil/4.0mil | ||
Min certer distance incontigeous finger | 0.10mm | ||
Min single line impedancetolerance | 50Ω+/-10% | ||
Impedance | 100Ω+/-10% | ||
SolderingResistance | 85---105°C / 280°C---360°C | ||
Basedmaterial(PI) thickness | 0.025mm---0.125mm | ||
Item | Surface Treatment Thickness | ||
PlatedTin | Tin:1—15um | ||
Plated Ni/gold | Ni:2—8um | ||
Gold:0.03—0.15um | |||
ENIG | Ni: 1—6um | ||
Gold:0.03—0.10um | |||
OSP | OSPfilm:0.2—0.7um | ||
Plated Tin | Tin:0.5—1um | ||
Plating | Gold:0.25—1um | ||
Twining and curving resistance/Chemicalresistance | International printed circuit IPC standard |