Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | 30UIO |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | XingDa | ModelNumber: | PCBA |
Base Material: | FR-4,FR2.Taconic,Rogers,CEM-1 CEM-3,ceramic,crockery,Metal | Copper Thickness: | 1/2 oz min; 12 oz max | Board Thickness: | 0.2mm-6mm(8mil-126mil) |
Min. Hole Size: | 0.1mm(4mil) | Min. Line Width: | 0.075mm(3mil) | Min. Line Spacing: | 0.1mm(4mil) |
Surface Finishing: | HASL/ HASL lead free, Chemical tin, Chemical Gold, Immersion Gold | Base Material:: | FR-4,FR2.Taconic,Rogers,CEM-1 CEM-3,ceramic,crockery,Metal | Copper Thickness:: | 1/2 oz min; 12 oz max |
Board Thickness:: | 0.2mm-6mm(8mil-126mil) | Min. Hole Size:: | 0.1mm(4mil) | Min. Line Width:: | 0.075mm(3mil) |
Min. Line Spacing:: | 0.1mm(4mil) | Surface Finishing:: | HASL/ HASL lead free, Chemical tin, Chemical Gold, Immersion Gold | Warp & Twist:: | 0.7% |
Hole Position:: | +/-0.075mm(3mil) CNC Drilling | PCBA: | PCB Assembly |
Packaging Detail: | 1. at buyer's request 2. inner, vacuum package 3. outer, standard exportcarton |
Delivery Detail: | 5-10 days |
Specification for PCBAManufacture: | |||
Item | FPC | PCB | Rigid Flex |
Layers | 1-8 layers | 1-38 layers | 2-4 layer |
Board Thickness | 0.05-0.5mm | 0.2-5mm | 0.3-2.2mm |
Min.line width/space | 0.04/0.04mm | 0.075/0.075mm | 0.1/0.1mm |
Min.Through Hole Size | 0.2mm | 0.25mm | 0.5mm |
PTH Hole Dia.Tolerance | &≤0.8mm0.05mm | &≤0.8mm±0.05mm | &≤0.8mm±0.05mm |
&≥0.8mm±0.075mm | &≥0.8mm±0.075mm | &≥0.8mm±0.075mm | |
Solder Mask RegistrationTolerance | ±0.05mm | ±0.05mm | ±0.05mm |
Min.Routing DimensionTolerance | ±0.05mm | ±0.1mm | ±0.1mm |
Hole to edge(Hard tool/DieCut) | ±0.1/±0.2mm | ||
Eege to Edge(Hard tool/DieCut) | ±0.05/±0.2mm | ||
Circuit to edge(Hard tool/DieCut) | ±0.07/±0.2mm | ||
Surface Treating Technology | Electrical FlashGold,Anti-Tarnish(OSP), | ||
Immersion Nickel-gold,HASL,ImmersionTin, |