Min. Order: | 5 Piece/Pieces |
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Payment Terms: | Paypal, T/T, WU |
Supply Ability: | 120000 Square Meter /Month |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | TWS-D77B |
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Means of Transport: | Ocean, Air, Land |
Brand Name: | TWS |
Base Material: | FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material |
Copper Thickness: | 0.5-4.0oz |
Board Thickness: | 0.2mm-7mm |
Min. Hole Diameter: | 0.25mm |
Min. Line Width: | 0.075mm(3mil) |
Min. Line Spacing: | 0.075mm(3mil) |
Surface Finishing: | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
Layer: | 1-28 Layer |
Solder Mask: | green/red/blue/white/yellow |
MAX.Board Size: | 9200*900mm |
Certification: | UL/SGS/ROHS |
Controlled impedance: | ±5% |
Warp&Twist: | 0.7% |
Rang of finish boards thickness: | 0.21~7.0mm |
Impedance control: | ±10% |
OEM/ODM: | One-stop service |
PCB standard: | IPC-A-610D |
Production Capacity: | 120000 Square Meter /Month |
Packing: | vacuum packaging and carton box |
Delivery Date: | 5-15 working days after your payments |
NO | ITEM | Technical Data | |||
1 | Layer | 1-28 Layers | |||
2 | Board material | FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base | |||
3 | Max.Board Size0 | 457*660mm | |||
4 | Min.Board Thickness | 2 layers 0.2mm | |||
4 layers 0.4mm | |||||
6 layers 0.8mm | |||||
8 layers 1.0mm | |||||
10 layers 1.2mm | |||||
5 | Max.Board Thickness | 8.0mm | |||
6 | Min.Line Width | 0.05mm | |||
7 | Min.Line Space | 0.05mm | |||
8 | Min.Hole Size0 | Electroplating Via 0.15mm | |||
Micro via 0.075mm | |||||
9 | PTH Wall Thickness) | 20-25um | |||
10 | Max.finish copper thickness0 | 8OZ | |||
11 | PTH Dia.Tolerance | ±0.05mm | |||
12 | NPTH Dia.Tolerance | ±0.025mm | |||
13 | Hole Position Deviation | ±0.05mm | |||
14 | Outline Tolerance | ±0.1mm | |||
15 | Min.S/M Pitch | 0.08mm | |||
16 | Insulation Resistance | 3x10Sec, 288°C | |||
17 | Warp and Twist | ≤0.7% | |||
18 | Electric Strength | >1.3KV/mm | |||
19 | Peel Strength | ≥1.4N/mm | |||
20 | Solder Mask Abrasion | ≥6H | |||
21 | Flammability | 94V0 | |||
22 | Impedance Control | ±5% | |||
1 | Layer | 1-16 layer | |||
2 | Material | FR-4, CEM-1, CEM-3, High-TG, FR4, Halogen Free, FR-1, FR-2, Aluminum | |||
3 | Board thickness | 0.2mm-4mm | |||
4 | Max. finished board side | 500mm*500mm | |||
5 | Min. drilled hole size | 0.25mm | |||
6 | Min. line width | 0.075mm (3mil) | |||
7 | Min. line spacing | 0.075mm (3mil) | |||
8 | Surface finishing | HALS/HALS lead free, Chemical tin | |||
9 | Copper thickness | 0.5-4.0oz | |||
10 | Solder mask color | Green/red/yellow | |||
11 | Inner packing | Anti-static bag packing | |||
12 | Outer packing | Carton packing | |||
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 | |||
14 | Certificate | ISO 9001 | |||
15 | Profiling Punching | Routing, V-CUT, Beveling | |||
16 | Assembly Service | Design and OEM | |||
17 | Production process | SMT, DIP, Bonding |