Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | 730rp |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | DT | ModelNumber: | DT-PCB-59 |
Number of Layers: | 4-Layer | Base Material: | FR-4 | Copper Thickness: | 1.0oz/2.0oz/3.0oz |
Board Thickness: | 0.8mm-2.0mm | Min. Hole Size: | 0.25mm | Min. Line Width: | 5.0mil |
Min. Line Spacing: | 0.1mm | Surface Finishing: | HAL/gold-plating/NI/OSP/golden-finger/leadfree HAL | Certificate: | ISO9001:2000,UL,SGS,RoHS |
plating thickness: | 12um-35um | Test: | Universal Electric Testing | pcb color: | customize |
Max dimension: | 600mm*600mm | Min dimension: | 5mm*5mm |
Packaging Detail: | Inner vacuum packing,outer standard carton box 34*27*20cm 42*26*20cm40*31*30cm 30*24*20cm 26*19*14cm 35*33*21cm 31*23*16cm 26*22*20cm 35*24*13cm49*23*16cm 30*23*20cm 36*26*17cm 30*20*20cm |
Delivery Detail: | According to the quantity,ASAP.3-20 days |
Min Thickness (Inner Layer Residue Copper 0.5oz, ResdiueCopper Rate 65%) | 4L | 6L | 8L | 10L | 12L | 14L |
16 mils | 24 mils | 32 mils | 40 mils | 48 mils | 56 mils | |
Min/Max Layer Count | Min 2 Layer, Max 22 Layer | |||||
Min Inner Layer Thickness | 4 mils | |||||
Min Trace / Space | 4/4 mils Protype 3/3 mils Copper (Thickness 1/3oz) | |||||
Min Finished Hole Size | 8 mils (Aspect Ratio 5) | |||||
Drilling Accuracy | ±3 mil | |||||
Lamination Evenness | ±3 mil | |||||
Min Channel of SMD Pitch | 10 mil | |||||
Min Channel of SMD Pitch | 8 mil | |||||
Min DAM Between Fine Pitch | 4 mil | |||||
Min Space of Soldermask | 4 mil | |||||
Layer To Layer Registration Tollence | ±3 mil | ±3 mil | ±3 mil | ±3 mil | ±3 mil | ±3 mil |
Impedance Control Tollance | 100 | |||||
100 ±10%, 50 ±10% | ||||||
Board Bow / Twist Tolerance | < 0.75% | |||||
Min Length (V-Cut) | 2 inch | |||||
Max Width (V-Cut) | 29 inch | |||||
Min Width (V-Cut) | 2 inch | |||||
Min Board Thickness (V-Cut) | 12 mils | |||||
Golden Finger Max Width Beveling | 70 mils | |||||
Max Working Size | 29 x 22.44 inch |