Min. Order: | 10 Piece/Pieces |
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Trade Term: | FOB |
Payment Terms: | L/C, T/T, WU |
Supply Ability: | 10000 square meter |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | tws-2013062401 |
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Means of Transport: | Ocean, Air, Land |
Brand Name: | TWS |
Base Material: | FR4 |
Copper Thickness: | 1OZ |
Board Thickness: | 1.6MM |
Min. Hole Size: | 0.2MM |
Min. Line Width: | 0.2MM |
Min. Line Spacing: | 0.15MM |
Surface Finishing: | ENIG |
Surface Finishing: | HASL,ENIG,OSP,immersion gold/silver/tin,gold plating,Gold finger |
color: | all colours |
contouring: | milling and V-cut |
Shape tolerance: | +/-0.13 |
Tolerance of finished panel thickness: | +/-10% |
Standard: | IPC-A-610D |
Certification: | UL,ISO |
legend colour: | white |
Name-layer pcb manufacturer: | Immersion gold pcb or ENIG pcb |
Production Capacity: | 10000 square meter |
Packing: | vacuum plastic and carton, suitable for any means of transport; |
Delivery Date: | 5-7 working days |
Place ofOrigin shenzhen China(mainland) | Brandname:TWS-PCB | ModelNumber:4layer |
Basematerial:FR-4 | Copperthickness:1oz | Boardthickness:1.6mm |
Min.Holesize:0.2mm | Min.linewidth:4mil | Min. LineSpace:4mil |
SurfaceFinishing:immersion gold | Soldermask:green | Legend :White |
Test:E-testing |
Packdetails: | Vacuumpacking,export carton |
Deliverytime: | 5-7days |
Productivity | ||
Item | Technicalstandards | |
Rise | 1-26layer | |
Material | CEM-1,CEM-3,FR-4,FR4TG170,TG180 ,HALOGEN FREE | |
Lamellar | 0.2mm-3.20m(8mil-126mil) | |
Minimumthickness | 0.1mm(4mil) | |
Thick copper | 0.5-6 OZ | |
Min line w / s | 0.075mm(3mil) | |
Min Hole Side | 0.20mm(8mil) | |
Min apertureChong | 0.9mm(35mil) | |
Tolerance | Hole drillingbit | ±0.075mm(3mil) |
Linewidth | ±0.05mm(2mil)Orwidth of ±20% | |
Aperture | PTH±0.075mm(3mil) | |
NPTH±0.05mm(2mil) | ||
Shapetolerance | MillingMachine±0.15mm(6mil) | |
Punch±0.10mm(4mil) | ||
Warp | 0.70%-1.5% | |
Pad surfacetreatment | Nickel/Gold Finger Plating/FlashGold/Entek/LEAD Free Hal | |
InsulationResistance | 10k-20MΩ | |
Conductionresistance | <50Ω | |
Test voltage | 300v | |
V Engraved | Panle size | 110*100mm(min.)660*600mm(max.) |
Thickness | 0.6mm(24mil)min. | |
Retention ofthe thickness | 0.3mm(12mil)min. | |
Tolerance | ±0.1mm(4mil) | |
Width | 0.50mm(20mil)max. | |
Trough to aline | 0.5mm(20mil)min | |
Trough | Slot sizetlo.≥2WTolerance | PTHL:±0.15mm(6mil) |
W:±0.1mm(4mil) | ||
NPTH:±0.125mm(5mil) | ||
W:±0.1mm(4mil) | ||
To circularfrom the hole | PTH Hole:0.13mm(5mil) | NPTH Hole:0.18(7mil) |
MLB | Circulardeviation | 0.075mm(3mil) |
Deviationbetween layers | 4 layers:0.15mm(6mil)max | |
6 layers:0.025mm(10mil)max. | ||
Aperture tothe smallest distance from theinner circle | 0.25mm(10mil) | |
To circularfromthe hole | 0.25mm(10mil) | |
ThicknessTolerance | 6 layers:±0.15mm(6mil) | |
6 layers:±0.15mm(6mil) | ||
CharacteristicImpedance | 60Ω±10% |