Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | T/T, WU |
Supply Ability: | 5000 |
Place of Origin: | Guangdong |
Location: | China (Mainland) |
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Business Type: | Manufacturer |
Model No.: | 0011002 |
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Brand Name: | winscon |
Base Material: | FR4 |
Copper Thickness: | 1oz |
Board Thickness: | 0.8mm |
Min. Hole Size: | 0.25mm |
Min. Line Width: | 4mil |
Min. Line Spacing: | 4mil |
Surface Finishing: | ENIG,OSP,HASL |
Production Capacity: | 5000 |
Delivery Date: | 5-7days |
PCB Producing Capability | ||||||
No. | Item | Producting Capability | ||||
1 | Layers | 2-20 | ||||
2 | PCB thickness | Max.:3.5mm | ||||
Min.:0.2mm | ||||||
3 | Panel Size | Max.:> 540MM | ||||
Min.:>100mm | ||||||
4 | Drilling | Min.:0.25mm | ||||
Max.:6.35mm | ||||||
5 | Immersion Copper | Max. 25.4UM | ||||
6 | dry film hole sealing capacity | Max.Hole(5.0mm) slot(5.0*3.0mm) | ||||
7 | Etching Tolerance | Min.:±20% or ±1mil | ||||
8 | Line width Min. | 4mil | ||||
Line space Min. | 4mil | |||||
9 | Electroplating | copper thickness of PTH | 12UM(min),25.4(max) | |||
electroplating Au | Ni | 100U" | ||||
Au | 0.6-1.5U" | |||||
Immersion Au | Ni | 100-250U" | ||||
Au | 1-3U" | |||||
Immersion Ag | 8-10U" | |||||
Immersion Pb | 0.8-1.0UM | |||||
electroplating Pin | Ni | 100U" | ||||
Au | 2-10U" | |||||
10 | solder resist | Width | Min.:4MIL | |||
Space | 3MIL | |||||
Hole | Max.0.5MM | |||||
11 | Outline Tolerance | Min.:±5MIL(0.13MM) | ||||
12 | Surface finish | HASL, Immersion Silver/Gold/Tin OSP, Plating Gold |