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large capacity memory
Company Profile
| Location: | China (Mainland) |
|---|---|
| Business Type: | Trading Company, Agent, Service |
Product Description
High-speed large-capacity memory
FLASH\/ High-speed large-capacity memory chips using FLASH-based high-capacity data storage technology, high-speed data pipeline technology and inspection / error-correcting codes (EDAC) technology to achieve high-speed data, high reliability storage, successfully used in military field.
Features:
1. storage media, an independent plug, simple structure, reasonable design, storage units can be independently pulled out and easy to carry, simple interface;
2. large capacity, fast read and write at the same time a highly integrated memory module and based on the parallel bus and pipeline access technology, to fully enhance the access to the system bandwidth to support read and write at the same time.
Technology, allowing the system to the huge amount of data input, storage and output is more smooth;
3. high-speed and efficient memory modules inspection / correction techniques used for high-speed expansion of SSR hamming (correcting a location 2) for encoding and decoding inspection / correction, using EDAC technology to ensure a high degree of accuracy of data input and output;
4. highly scalable to support multi-board parallel and multi-channel data transmission, and upon request, customized input / output interfaces (LVDS, TTL, FC, GE, 1394, etc.);
5. high reliability, using a strict selection of components, with the military temperature, moisture vapor barrier, vibration and so on.
Main Technical Specifications:
Maximum Write Rate: 1Gbps
Maximum Reading Rate: 800Mbps
Storage Capacity: 2Tbits
Power consumption: 5W
Weight: 2Kg
Size: 200mm × 110mm × 120mm
Features:
1. storage media, an independent plug, simple structure, reasonable design, storage units can be independently pulled out and easy to carry, simple interface;
2. large capacity, fast read and write at the same time a highly integrated memory module and based on the parallel bus and pipeline access technology, to fully enhance the access to the system bandwidth to support read and write at the same time.
Technology, allowing the system to the huge amount of data input, storage and output is more smooth;
3. high-speed and efficient memory modules inspection / correction techniques used for high-speed expansion of SSR hamming (correcting a location 2) for encoding and decoding inspection / correction, using EDAC technology to ensure a high degree of accuracy of data input and output;
4. highly scalable to support multi-board parallel and multi-channel data transmission, and upon request, customized input / output interfaces (LVDS, TTL, FC, GE, 1394, etc.);
5. high reliability, using a strict selection of components, with the military temperature, moisture vapor barrier, vibration and so on.
Main Technical Specifications:
Maximum Write Rate: 1Gbps
Maximum Reading Rate: 800Mbps
Storage Capacity: 2Tbits
Power consumption: 5W
Weight: 2Kg
Size: 200mm × 110mm × 120mm
