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blind buried hole board
| Place of Origin: | Guangdong |
|---|
Company Profile
| Location: | China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | PCB, FPC, Gold Fingure, SMT |
Product Detail
| Number of Layers: | 4-Layer |
|---|---|
| Brand Name: | beyond |
| Base Material: | FR4 |
| Copper Thickness: | 0.5-5.0 |
| Board Thickness: | 0.3-3.2 |
| Min. Hole Size: | 0.03 |
| Min. Line Width: | 0.1 |
| Min. Line Spacing: | 0.1 |
Product Description
Base material: FR4, FR1, FR2, CEM-1, CEM-3
Layer:1-12 layer
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers
Layer:1-12 layer
Board thickness: 0.30 to 3.20mm (12 to 26mil)
Copper thickness: 0.50 to 5 ounce
Solder mask: LPI solder mask, conventional solder mask, peelable solder mask, UV solder mask
Minimum line width: 0.1mm (4mil)
Minimum line space: 0.1mm (4mil)
Minimum hole diameter: 0.25mm (10mil)
PTH hole diameter tolerance: +/-0.076mm (+/-3mil)
NPTH hole diameter tolerance: +/-0.03mm (+/-1.2mil)
Maximum board size: 460 x 620mm (18 x 24)
Board finishing type: Hot air leveling, soft gold, hard gold, immersion gold, gold fingers
