custom wafer laser dicing
| Min. Order: | 1 Piece/Pieces |
|---|---|
| Trade Term: | FOB,CFR,EXW |
| Payment Terms: | T/T |
| Supply Ability: | 500000000pcs |
| Place of Origin: | Jiangsu |
Company Profile
| Location: | China (Mainland) |
|---|---|
| Business Type: | Manufacturer, Distributor/Wholesaler |
Product Detail
| Means of Transport: | Air |
|---|---|
| Brand Name: | Delphi |
| Production Capacity: | 500000000pcs |
| Packing: | carton |
| Delivery Date: | 7days |
Product Description
Laser is an efficient way for silicon or glass wafer dicing, widely apply to semiconductors, MEMS, electronics.
coated chip dicing,and we also has the ablity to do stealth dicing, it is the most advaced dicing in the world.
our company provide laser precision machining for coated
chip dicing, ,and our laser server has many advatage:
1. high precision,for mass producion, accuracy can be controlled in the micron level.
2. good edge quality,Compared to machining,there is litter chip.