This reed relay is the smallest in the industry and switches in the billions of operations. This Relay uses no internal solder and has 1 µV typical thermal offset. Measuring only 8.6mm x 4.4 mm x 3.4 mm, the leadless design eliminates skewing of leads and co-planarity issues. Insulation resistance typical to all points is >10
14 Ohms.
Specifications
Coil Voltage (VDC) | 3 to 5 |
Coil Resistance (Ohm) | 70 to 150 |
Contact Form | 1A; 1B |
Rated Power (W) | 0 to 10 |
Switching Voltage (VDC) | 0 to 170 |
Switching Current (A) | 0 to 0.5 |
Carry Current (A) | 0 to 0.5 |
Breakdown Voltage (Minimum VDC) | 210 |
Features
- Ceramic / thermoset molded package
- Patent pending
- Smallest in the industry
- No lead frame surface mount design eliminates skewing of leads and co-planarity issues
- Available with BGA (Ball Grid Array)
- Internal magnetic shield standard
- Very low profile
- Gold plated leads
- Low thermal offset typical of 1 µV
- TCE matching of all internal components
- Insulation resistance typical of 1014 Ohms
- 3 volt option available
Applications
- Telecommunications
- Test and measurement systems
- Medical applications