DB|Low Temperature Curing Adhesive
| Min. Order: | 50 Piece/Pieces |
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| Place of Origin: | Shandong |
Company Profile
| Location: | Qingdao, Shandong, China (Mainland) |
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| Business Type: | Manufacturer, Trading Company, Service |
Product Detail
| Model No.: | DB291 |
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| Brand Name: | DOCBOND |
Product Description
DB291
This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a very short time. The product has excellent working performance and high storage stability. This product is suitable for low-temperature curing process, mainly used for bonding heat-sensitive components,suitable for memory cards, CCD/CMOS, LED backlights etc.
