DB|Underfill one-component epoxy sealant
| Min. Order: | 50 Piece/Pieces |
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| Place of Origin: | Shandong |
Company Profile
| Location: | Qingdao, Shandong, China (Mainland) |
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| Business Type: | Manufacturer, Trading Company, Service |
Product Detail
| Model No.: | DB840B |
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| Brand Name: | DOCBOND |
Product Description
DB840B
The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for better underfilling; and good reworkability.
