It can be used as an adhesion promoter or primer in coating and sealants industries. Its epoxy functionality offers non-yellowing adhesion in various resin systems.
It can be used as a crosslinker and an adhesion promoter in waterborne applications including acrylic and polyurethane coatings.
It can be used to enhance adhesion and improve electricity properties of EMC (epoxy molding compound), electronic encapsulation and packaging materials.
It can act as a surface modifier of inorganic materials such as fillers, glass fiber and metals. It can improve the bonding performance between organic resin and inorganic substrates. Suitable resins are epoxy, polyurethane, acrylic, polysulfide and so on.
It can be used to improve mechanical properties and electrical properties of various epoxy composites. Wet adhesion, anti-corrosion and water-proof properties could be enhanced.
