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365nm 385nm 405nm COB SMD UV LED Module For DLP 3D Printer

0.1 USD
Min. Order: 1 Piece/Pieces
Trade Term: CIF,EXW
Payment Terms: Paypal, D/P, T/T, WU, Money Gram
Supply Ability: 100000000pcs/month
Place of Origin: Guangdong

Company Profile

Location: Guangzhou, Guangdong, China (Mainland)
Business Type: Manufacturer

Product Detail

Model No.: TLM2728A01
Means of Transport: Air
Plate: Others
Type: Others
Color & Page: Others
Usage: Others
Brand Name: BYTECH
Peak Wavelength: 360-370nm
Radiation Angle: 120 Degree
Radiant Flux: 9-11w
Lifespan Hours: >20000 Hours
Dimension: 28mm*42mm*5.3mm
Applications: 3D Printing, Curing, Lithography
Production Capacity: 100000000pcs/month
Packing: Anti-electrostatic packaging
Delivery Date: 2-7working days
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Product Description

365nm 385nm 405nm COB SMD UV LED Module For DLP 3D Printer


Company Introduction:

 

Bytech is the first company in China to launch full inorganic package UV LED which is based on CMH(Ceramic,Metal,hard glass) technology platfrom. And we has applied for 15 patents since 2013 inculding 13 authorized patents. At present, We can provide CMH series (high reliability) and U/ D series (high cost performance) products. It covers curing, printing, (money) authentication, medical, disinfection/ sterilization and security industry.

 

 

Characteristics of TLM2728A01

 

1. Electrical / Optical Characteristics (Ta=25℃, RH=40%)

 

ParameterSymbolUnitsValue)
Test currentIA9.0
Forward VoltageVFV3.3-4.0
Peak Wavelengthλpnm360~370
Radiant FluxΦeW9-11
Spectrum Half WidthΔλnm15-18

 

2. Absolute Maximum Ratings (Ta=25°C, RH=40%)

 

ParameterSymbolUnitsValue
Maximum Rating Forward CurrentIFmaxA24
Maximum Rating Junction TemperatureTjmax°C125
Operating Temperature RangeTopr°C-10 ~ +85
Storage Temperature RangeTstg°C-40 ~ +100

 

Features 


● UVA LED COB module 

● High thermal conductivity common cathode copper substrate package 

● With ESD protection device 

● Quartz glass lens 

● Dimension:28mm×42mm×5.3mm 

● Long operating life 

● RoHS compliant 


Product ID TLM2728A0V221Z1A1-R9-S1P12 


* T:High thermal conductivity copper substrate; 

* L:Aluminum dam; 

* M:COB Module; 

* 2728:Dimension of copper substrate 26.8*28mm; 

* A0:Chip peak wavelength code:400~410nm; 

* V221:LED chip code; 

* Z1:Zener chip code; 

* A1:Product version; 

* R9:Resistance code; 

* S1P12:Chips combination, 1 in series 12 in parallel.


Package Dimensions and Circuit:

(Unit: mm)

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