BERGQUIST SIL-PAD 1000L FEATURES AND BENEFITS
● Thermal impedance: 1.13ºC-in 2 /W @ 50 psi
● Original Sil-Pad material
● Excellent mechanical and physical characteristics
● Flame retardant
BERGQUIST SP1000LAC TYPICAL APPLICATIONS
● Mount heat sink onto BGA graphic processor or drive
processor
● Mount heat spreader onto power converter PCB or onto
motor control PCB
BERGQUIST SIL PAD TSP 1700L material is designed for
applications where low mounting pressure is used and low
thermal resistance is required. BERGQUIST SIL PAD TSP
1700L achieves this with the combination of a smooth surface
design and high thermal conductivity (dielectric) silicone rubber
.
Applications requiring low component clamping forces include
discrete semiconductors (TO-220, TO-247 and TO-218)
mounted with spring clips. Spring clips provide quick assembly
but apply a limited amount of pressure to the semiconductor.
The smooth surface texture of BERGQUIST SIL PAD TSP
1700L minimizes interfacial thermal resistance and maximizes
thermal performance.
