Min. Order: | 1 Square Meter |
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Trade Term: | FOB,CIF,DAT,DDP,DAP,CIP,CPT,EXW |
Payment Terms: | Paypal, L/C, D/P, T/T, WU, Money Gram |
Supply Ability: | 1500squire meter/week |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Model No.: | Customized |
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Means of Transport: | Ocean, Air, Land |
Number of Layers: | 12-Layer |
Brand Name: | Hitech |
Base Material: | Aluminum |
Copper Thickness: | 1OZ |
Board Thickness: | 1.2MM |
Min. Hole Size: | 0.36MM |
Min. Line Width: | 0.22MM |
Min. Line Spacing: | 0.14mm |
Solder mask: | Green,Black,Blue,Red |
Wrap and twist: | 5% |
Profiling punching: | Routing, V-CUT, Beveling |
Testing: | 100% E-Test |
Standards: | IPC-A-610 E Class II-III |
Mounting Production: | 6 SMT Lines |
Through Hole Production: | 2 DIP Lines |
Enclosure Assembly: | 2 Assembly Lines |
Package: | Vacuum Skin Double-Sided |
profiling punching: | Routing, V-CUT, Beveling |
Production Capacity: | 1500squire meter/week |
Packing: | 35*26*12mm/carton |
Delivery Date: | 5-8 WDs |
High tension aluminum pcb for led/Large Quantity Copper base Aluminum Base PCB
About the Aluminum PCB
Aluminum PCB is one of metalbased pcb,including copper foil,thermal insulating layer and metal substrate,its structure divide into three layers:
1. Circuit layer: the equivalent of an ordinary PCB,copper thickness from 1oz to 10oz.
2. Insulation layer: Insulation is a layer of thermal insulating material with low thermal resistance.Thickness: 0.003 "to 0.006" inch is the aluminum pcb core technology.
3. Based Layer: a metal substrate,usually aluminum or copper may be chosen.
Our Superiority is the Professionalism of our team.
- PCB And PCB Assembly For One-stop Service with Original Components According the BOM.
IC Imported from Digikey / Farnell etc.
- Low Cost with High Quality, Commitment of Quality Assurance.
- For 10 years Experience in PCB Field. ( Our Factory owns advanced
production equipment and experienced technical personnel. )
PCB and PCB Assembly Lead time:
Description | Double side | Four Layers | Six Layers | Above Eight Layers | HDI |
Sample | 4 | 7 | 9 | 9 | 12 |
Mass production | 7-9 | 10-12 | 13-15 | 16 | 20 |
Assembly | 7-9 | 15 | 16 | 18 | 25 |
Equipment List
NO. | Machine Name | QTY | NO. | Machine Name | QTY |
1 | PRESS | 2 | 10 | Exposurer | 5 |
2 | X-Ray | 1 | 11 | Deveoloper | 3 |
3 | Brown-Oxidation | 1 | 12 | Auto V-cut | 1 |
4 | Drilling | 13 | 13 | AOI | 2 |
5 | Cutter | 1 | 14 | Routing | 7 |
6 | PTH | 1 | 15 | ETS | 12 |
7 | PAL | 1 | 16 | Fly Probe | 4 |
8 | PAT | 1 | 17 | YAMAHA SMT | 3 |
9 | Flash Gold | 1 | 18 | FUJI SMT | 4 |
T-SOAR can be trusted PCB Partner, We are waiting for cooperation with you anytime.
- UL, RoHS, ISO, SGS Certification Compliance.
- OEM Assembly, Design, Prototype Service.
- We will be responsible for the quality of our products,
- Survive by quality, Win by Price.
Detailed specification of manufaturing capacity:
NO | Item | Craft Capacity |
1 | Layer | 1-30 Layers |
2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
3 | Rang of finish baords Thickness | 0.21-7.0mm |
4 | Max size of finish board | 900MM*900MM |
5 | Minimum Linewidth | 3mil (0.075mm) |
6 | Minimum Line space | 3mil (0.075mm) |
7 | Min space between pad to pad | 3mil (0.075mm) |
8 | Minimum hole diameter | 0.10 mm |
9 | Min bonding pad diameter | 10mil |
10 | Max proportion of drilling hole and board thickness | 1:12.5 |
11 | Minimum linewidth of Idents | 4mil |
12 | Min Height of Idents | 25mil |
13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
15 | Minimun thickness of soldermask | 10um |
16 | Color of silk-screen | White, Black, Yellow ect. |
17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
21 | Thickness of Copper | 0.5-14oz (18-490um) |
Quote Requirements for PCB and PCB Assembly project
- Gerber File and Bom List;
- Quote Quantity;
- Advise your technical requirements for quoting reference;
- Clearly picturers of PCB or PCB Assembly Sample to us for reference;
- Test Mothod for PCB Assembly.