Sinopack Ceramic Packages Manufacturer for Wireless Communication Devices

Sinopack provides ceramic-to-metal seal packages for RF power transistors such as FETs and HEMTs. Ceramic feedthroughs with low electrical-resistance and heat sinks with high thermal conductivity are available for high power devices.

Sinopack also supplies thin-film-metallized ceramic substrates for hybrid MICs, in addition to MMIC packages that feature options of feedthrough, RF via, and electro-magnetic coupling structures suitable for frequencies up to 90GHz and beyond.

Sinopack devotes to the R&D and manufacturing of multilayer ceramic packages. The main products are HTCC, LTCC, and ALN ceramic packages and substrates. products cover different domains  such as optical communication module package, power laser package, microwave device package, high-  density integrated circuit package, ALN substrate products and other fields of package. Committed to doing a good job for the ceramic package , efforts to build a high quality brand, with sincerely heart to provide the highest quality products