user login

Stencil Printer PCB Screen Printing Machine Solder Paste Printer

1.0 USD
Min. Order: 1 Set/Sets
Payment Terms: Paypal, L/C, D/P, D/A, T/T, WU, Money Gram
Supply Ability: 100 sets/month
Place of Origin: Guangdong

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer, Distributor/Wholesaler

Product Detail

Model No.: Jaguar F850
Means of Transport: Ocean, Air, Land
Brand Name: JAGUAR Automation
name: full auto stencil printer
Repeat Position Accuracy: 0.08mm
PCB Size/Max: 400X340mm
Dimensions: 2220(W) X 1220(D) X1500(H)mm
Weight: 1300kg
Production Capacity: 100 sets/month
Packing: wooden box
Delivery Date: 15 work days
Show

Product Description

Stencil Printer PCB Screen Printing Machine Solder Paste Printer

Specification
* The following data is measured under environment temperature of 25 ºC and humidity of 60%.

           Items
               Parameter
Repeat Position Accuracy±0.01mm
Printing Accuracy±0.025mm(Absolute Guarantees)
Cycle Time<11s (Excluding Printing & Cleaning)
Products Changeover<5Min
Screen Stencil Size/Min737mm X 737mm(Note: Cleaning Adhesive tape shall be replaced for 737mm stencil)
Screen Stencil Size/Max1100mm X 900mm
Screen Stencil Thickness20mm ~ 40mm
PCB Size/Min100X80mm
PCB Size/Max850X500mm
PCB Thickness0.8~6mm
PCB Warpage Ratio<1%(Based on diagonal length)
Bottom of Board Size13mm(standard configuration), 25mm(optional configuration)
Edge of Board Size3mm
Transport Height900±40mm
Transport DirectionLeft-Right; Right-Left; Left-Left; Right-Right
Transport Speed100-1500mm/sec Programmable
Board LocationSupport SystemMagnetic pin/ Side support block/ Flexible automatic pin(optional)
Clamping SystemElastic side clamping/Vacuum nozzle/Elastic Z-direction tabletting(optional)
Print headProgrammable integrated motor driven and pneumatic control print head
Squeegee Speed10~200mm/sec
Squeegee Pressure0~0.5MPa with adjustable pressure reducing meter valve
Squeegee Angle60°(Standard)/ 55°/ 45°
Squeegee TypeSteel squeegee (standard), rubber squeegee,  customizable other types of squeegee.
Stencil Separation Speed0.1~20mm/sec Programmable
Cleaning MethodsDry-type, wet-type, vacuum-type ( Programmable combination of Cleaning methods)
Table Adjustment RangeX: ±4mm;Y:±6mm;θ:±2°
Type of Image Fiducial MarkStandard geometry shape of fiducial mark, bonding pad / stencil hole
Camera SystemSingle digital camera with upward/downward vision system
Air Pressure4~6Kg/cm2
Air ConsumptionApprox 0.07m3 /min
Control MethodPC Control
Power SupplyAC:220±10%,50/60HZ 1Φ 1.5KW
Machine Dimensions1740mm(W) x 1560mm(D) x 1510(H)mm (excluding the height of indicating lighthouse)
WeightApprox:1300Kg
Operation Temperature-20°C ~ +45°C
Operation Humidity30%~60%


Product Functions:
Machine is a high accuracy extra dimension solder paste  printer designed for high precision screen printing or stencil printing in SMT industry.
2.    Product Features:
a)    Wide compatibility for PCB dimensions from 100mm x 80mm to 850mm x 500mm and PCB thickness from 0.8mm to 6mm.
b)    High printing resolution
1.    High positional accuracy, repeated positioning accuracy ±0.01mm; printing accuracy 0.025mm.
2.    Support glue printing.
c)    Automatic control improves production efficiency, quality control and saves production cost:
1.    Automatic stencil positioning
2.    Automatic PCB alignment
3.    Automatic adjustment of squeegee pressure
4.    Automatic printing
5.    Automatic stencil cleaning (dry-type, wet-type and vacuum-type)
d)    Adopt company independently developed suspended print head and programmable automatic pressure adjustment system with pressure closed-loop feedback. Support on-line real time pressure feedback and automatic squeegee pressure balancing. Accurate pressure control ensures perfect forming effect of solder paste.
e)    Programmable motor controls squeegees separation speed and distance among squeegees, steel mesh and substrate board to realize multi-method separation.
f)    Multi-functional PCB positioning and clamping system for fast, convenient and accurate PCB positioning.
g)    Upward and downward visual positioning.
h)    Built-in image processing system
i)    Support 2D,SPC functions    
3.    Applicable pitches of Components
a)    SMT Components such as resistors, capacitors, inductors, diode and triode: 0201, 0402, 0603, 0805, 1206 and other specifications.
b)    IC: support SOP, TSOP, TSSOP, QFN packaging, min. pitch 0.3 mm; support BGA, CSP packaging, min. ball diameter of 0.2 mm.
c)    Printing size:100mm x 80mm ~850 mm x 500 mm
d)    PCB Thickness:0.8 mm ~ 6 mm
e)    FPC Thickness:thickness<= 0.8 mm (excluding jig)


Post Buying Request