10 in 1 iPhone A9 A8 A7 CPU BGA chip graver tool and disassembly tool
| Min. Order: | 1 Bag/Bags |
|---|---|
| Trade Term: | FOB,CFR,CIF,DAT,FAS,DDP,DAP,CIP,CPT,FCA,EXW |
| Payment Terms: | Paypal, L/C, D/P, D/A, T/T, WU, Money Gram |
| Supply Ability: | 10000 |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Guangzhou, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer, Trading Company |
Product Detail
| Model No.: | VC443 |
|---|---|
| Means of Transport: | Air |
| Brand Name: | vipprog |
| Production Capacity: | 10000 |
| Delivery Date: | 3-5days |
Product Description
10 in 1 graver tool and disassembly tool Set for iPhone A9 A8 A7 A6 A5 A4 Main Logic Board BGA Chip, Proffesional iPhone A9 A8 A7 remove repair tool set for iPhone CPU disassemble
10 in 1 iPhone A9 A8 A7 CPU BGA chip graver tool and disassembly tool
[Optional Type]:
Optional 1: One handle and 10 pcs blades in different shape
Optional 2: 10pcs handle and 10 pcs blades in different shape
For BGA repair, dismantling phone CPU chip and phone repair
It can be used to separate the welding spot
The ultra thin blade is made of alloy steel,which is good toughness,
high temperature resistant, no deformation and hard-wearing
disassembling
All-metal handle is equipped with a high temperature resistant tip which
can clamp the blade tightly, bring a comfortable use feeling to users
Instructions:
1: to clean the knife edge position when the demolition glue chip and chip temperature around 200 Vinyl
2: hot air gun to open 150 degrees, 60 pairs of large air speed for 2 minutes to warm up the motherboard
3: Hot air gun put a small head, a temperature of 350 degrees to open
the first blow of the knife position about 10 seconds and then shake
inserted into the bottom of the chip.
