Min. Order: | 1 Bag/Bags |
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Trade Term: | FOB,CFR,CIF,DAT,FAS,DDP,DAP,CIP |
Payment Terms: | Paypal, L/C, D/P, D/A, T/T, WU, Money Gram |
Supply Ability: | 10000 |
Place of Origin: | Guangdong |
Location: | Guangzhou, Guangdong, China (Mainland) |
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Business Type: | Manufacturer, Trading Company |
Model No.: | VC713 |
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Means of Transport: | Air |
Brand Name: | vipprog |
Production Capacity: | 10000 |
Delivery Date: | 3-5days |
2017 New patent products: prevent convex BGA Reballing Tin net, iphone A10/A9/A8 CPU BGA Reballing Stencil Template Tin net, BGA Reball Reballing Stencil Template with ventilation hole, it will supply the heat radiation function, with many thermal via louver, and prevent bulges and avoid hump on the BGA Reballing Stencil Template.
0.12MM BGA Reballing Stencil Template Tin net for iphone A10/A9/A8 CPU
[ Optional ]:
Optional 1: A8 upper
Optional 2: A8 lower
Optional 3: A9 upper
Optional 4: A9 lower
Optional 5: A10 lower
With ventilation hole, prevent bulges and avoid hump, it is the prevent bulges BGA Reballing Stencil Template with ventilation hole.
Features:
1: with Cooling hole design, prevent bulges and avoid hump
2: Top quality Steel sheet material, Not easily deformed
3: smooth wall of hole, easy to doing BGA Reballing