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BGA Reballing Stencil Template Tin net for iphone A10/A9/A8 CPU

4.99 USD
Min. Order: 1 Bag/Bags
Trade Term: FOB,CFR,CIF,DAT,FAS,DDP,DAP,CIP
Payment Terms: Paypal, L/C, D/P, D/A, T/T, WU, Money Gram
Supply Ability: 10000
Place of Origin: Guangdong

Company Profile

Location: Guangzhou, Guangdong, China (Mainland)
Business Type: Manufacturer, Trading Company

Product Detail

Model No.: VC713
Means of Transport: Air
Brand Name: vipprog
Production Capacity: 10000
Delivery Date: 3-5days
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Product Description

2017 New patent products:  prevent convex BGA Reballing Tin net, iphone A10/A9/A8 CPU BGA Reballing Stencil Template Tin net, BGA Reball Reballing Stencil Template with ventilation hole, it will supply the heat radiation function, with many thermal via louver, and prevent bulges and avoid hump on the BGA Reballing Stencil Template.


0.12MM BGA Reballing Stencil Template Tin net for iphone A10/A9/A8 CPU


[ Optional ]:
Optional 1:  A8 upper
Optional 2:  A8 lower
Optional 3:  A9 upper
Optional 4:  A9 lower
Optional 5:  A10 lower


With ventilation hole,  prevent bulges and avoid hump, it is the prevent bulges BGA Reballing Stencil Template with ventilation hole.


Features:

1: with Cooling hole design, prevent bulges and avoid hump

2: Top quality Steel sheet material, Not easily deformed

3:  smooth wall of hole, easy to doing BGA Reballing



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