WL 0.1mm BGA Reballing Stencil for iphone Baseband NAND A10 A9 A8 CPU

WL 0.1mm BGA reballing Solder template stencil for iphone Baseband NAND A10 A9 A8 CPU, Ball Soldering Net Stainless Steel for iphone 5/5s  6/6p 6s/6sp 7/7p Baseband and NAND Chip, A6 A7 A8 A9 A10 CPU

WL 0.1mm BGA Reballing Stencil for iphone Baseband NAND A10 A9 A8 CPU

[ Optional BGA Reballing Stencil Package ]:
Optional 1: iphone 5/5s Baseband and NAND
Optional 2: iphone 6/6p Baseband and NAND
Optional 3: iphone 6s/6sp Baseband and NAND
Optional 4: iphone 7/7p Baseband and NAND
Optional 5: A6 CPU upper
Optional 6: A7 CPU upper
Optional 7: A6/A7 CPU Lower
Optional 8: A8 CPU upper
Optional 9: A8 CPU lower
Optional 10: A9 CPU upper
Optional 11: A9 CPU lower
Optional 12: A10 CPU lower

[ Optional  Aluminum Mould Base ]:  it is universal, can fit with any Black Positioning Mold,

1: Included base
2: Without base

Optional Positioning Mold (Black): Not univeral, can't working with different BGA Reballing Stencil, need the right model BGA Reballing Stencil, the Black Positioning Mold just match with the right BGA Reballing Stencil.

1: Included Positioning Mold
2: Without Positioning Mold

there have 3 parts section,  BGA Reballing Stencil + Positioning Mold (Black)  + Universal Aluminum Mold Base (Golden)

just the BGA Reballing Stencil

BGA Reballing Stencil  + Black Positioning Mold

Full Set: BGA Reballing Stencil + Positioning Mold (Black)  + Universal Aluminum Mold Base (Golden)

0.1-0.12mm thickness, high hardness, hardly deformed,  increase the success rate on BGA reballing Solder working, it is the  top quality BGA Reballing Stencil  for iphone Baseband CPU and NAND, A10 / A9 / A8 CPU..

WL Top quality Fast Speed BGA reballing Solder template stencil