iPhone 7 7P A10 lower Baseband CPU WIFI tin plate steel BGA reballing Solder template
0.99 USD
| Min. Order: | 1 Bag/Bags |
|---|---|
| Trade Term: | FOB,CFR,CIF,DAT,FAS,DDP,DAP,CIP,CPT,EXW |
| Payment Terms: | Paypal, L/C, D/P, D/A, T/T, WU, Money Gram |
| Supply Ability: | 10000 |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Guangzhou, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer, Trading Company |
Product Detail
| Model No.: | VC574 |
|---|---|
| Means of Transport: | Air |
| Brand Name: | vipprog |
| Production Capacity: | 10000 |
| Delivery Date: | 3-5days |
Product Description
iPhone 7 7P BGA Reballing Stencil dedicate kit, iphone7 7P A10 lower Baseband CPU heating Reball Tool, Ball Soldering Net Stainless Steel Plate for iphone 7 7 plus A10 lower Baseband CPU WIF.
iPhone 7 7P A10 lower Baseband CPU WIFI tin plate steel
[ Optional ]:
Optional 1: K01 A10 CPU
Optional 2: K02 Baseband CPU
Optional 3: K03 WIFI
Optional 4: K04 Big Power IC
Optional 5: K06 Small Power IC