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China Supplier PCB Design for Mini GPS Tracker PCB Circuit Board

Place of Origin: Hebei

Company Profile

Location: Shijiazhuang, Hebei, China (Mainland)
Business Type: Manufacturer

Product Description

Article

Description

Capability

Material

Laminate materials

FR4,Alu,CEM3,Taconic,Rogers

Board cutting

Number of layers

1-32


Min. Thickness for inner layers 

(Cu thickness are excluded)

0.003"(0.07mm)

Board thickness

Standard

0.04-0.16"±10%(0.1-4mm±10%)


Min.  

Single/Double layer: 0.008±0.004"



4 layer: 0.01±0.008"


  

8 layer: 0.01±0.008"


Bow and twist

<7/1000

Copper weight

Outer Cu weight  

0.5-4 oz  


Inner Cu weight

0.5-3 oz

Drilling

Min size

0.0078" (0.2mm)


Drill deviation

±0.002" (0.05mm)


PTH hole tolerance

±0.002" (0.005mm)


NPTH hole tolerance

±0.002" (0.005mm)

Plating

Min hole size

0.0008" (0.02mm)


Aspect ratio

20 (5:1)

Solder mask

Color

Green,white,black,red,yellow,blue...


Min solder mask clearanace

0.003" (0.07mm)


Thickness

0.0005-0.0007"(0.012-0.017mm)

Silkscreen

Color

White,black,yellow,red,blue...


Min size

0.006" (0.15mm)  

E-test

Flying Probe Tester

Y

Controlled 

Impedance

Tolerance

±10%


Impedance tester

Tektronix TDS8200

Surface Finish

HASL,ENIG,immersion silver,immersion tin,OSP...

 

 

 

 

 

 

 

 

 

 

 

 

 

No

Item

Specification

1

Type of Assembly

SMT Assembly (Surface-mounting technology)



Thru-hole Assembly (Through-hole soldering Technology)

2

Solder Type

Water soluble solder paste, lead free

3

Component

Component sourcing service

4

Min. IC Pitch

0.30mm

5

Foot Pin

SO, SOP, SOJ, TSOP, TSSOP, QFP, BGAand U-BGA

6

Min. Chip Placement

1005

7

Max. PCB Size

600mm*400mm

8

Min. PCB Thickness

0.35mm

9

Max. BGA Size

74mm*74mm

10

Max. Ball Pitch

1mm-3mm

11

Max. Ball Diameter

0.4mm-1mm

12

QFP Lead Pitch

0.38mm-2.54mm

13

Package

Inner package: anti-static bubble Bag



Outer Package: carton box

14

Certificate

PCB Assembly with UL, RoHS approval

 

 

  

 



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