Place of Origin: | Hebei |
---|
Location: | Shijiazhuang, Hebei, China (Mainland) |
---|---|
Business Type: | Manufacturer |
Article | Description | Capability |
Material | Laminate materials | FR4,Alu,CEM3,Taconic,Rogers |
Board cutting | Number of layers | 1-32 |
Min. Thickness for inner layers (Cu thickness are excluded) | 0.003"(0.07mm) | |
Board thickness | Standard | 0.04-0.16"±10%(0.1-4mm±10%) |
Min. | Single/Double layer: 0.008±0.004" | |
4 layer: 0.01±0.008" | ||
8 layer: 0.01±0.008" | ||
Bow and twist | <7/1000 | |
Copper weight | Outer Cu weight | 0.5-4 oz |
Inner Cu weight | 0.5-3 oz | |
Drilling | Min size | 0.0078" (0.2mm) |
Drill deviation | ±0.002" (0.05mm) | |
PTH hole tolerance | ±0.002" (0.005mm) | |
NPTH hole tolerance | ±0.002" (0.005mm) | |
Plating | Min hole size | 0.0008" (0.02mm) |
Aspect ratio | 20 (5:1) | |
Solder mask | Color | Green,white,black,red,yellow,blue... |
Min solder mask clearanace | 0.003" (0.07mm) | |
Thickness | 0.0005-0.0007"(0.012-0.017mm) | |
Silkscreen | Color | White,black,yellow,red,blue... |
Min size | 0.006" (0.15mm) | |
E-test | Flying Probe Tester | Y |
Controlled Impedance | Tolerance | ±10% |
Impedance tester | Tektronix TDS8200 | |
Surface Finish | HASL,ENIG,immersion silver,immersion tin,OSP... |
No | Item | Specification |
1 | Type of Assembly | SMT Assembly (Surface-mounting technology) |
Thru-hole Assembly (Through-hole soldering Technology) | ||
2 | Solder Type | Water soluble solder paste, lead free |
3 | Component | Component sourcing service |
4 | Min. IC Pitch | 0.30mm |
5 | Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGAand U-BGA |
6 | Min. Chip Placement | 1005 |
7 | Max. PCB Size | 600mm*400mm |
8 | Min. PCB Thickness | 0.35mm |
9 | Max. BGA Size | 74mm*74mm |
10 | Max. Ball Pitch | 1mm-3mm |
11 | Max. Ball Diameter | 0.4mm-1mm |
12 | QFP Lead Pitch | 0.38mm-2.54mm |
13 | Package | Inner package: anti-static bubble Bag |
Outer Package: carton box | ||
14 | Certificate | PCB Assembly with UL, RoHS approval |