BGA reballing tools solder wick desoldering wire for chips cleaning
| Trade Term: | FOB |
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| Payment Terms: | L/C, D/P, D/A, T/T |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
Product Detail
| Means of Transport: | Ocean, Air, Land |
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Product Description
100% Japan original goot wick,width 3mm,length 1.5mm,was used for cleaning the removal tin on BGA