Shuttle star BGA reballing kit for IC chip renew and rework
| Trade Term: | FOB |
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| Payment Terms: | L/C, D/P, D/A, T/T |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
Product Detail
| Means of Transport: | Ocean, Air, Land |
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Product Description
Easy to operate,automatic lock and unlock system,two screw four corners positioning at the same time,with tin balls storage and pull out groove