Pure tin 99.9% lead solder balls for computer chips reballing
| Trade Term: | FOB |
|---|---|
| Payment Terms: | L/C, D/P, D/A, T/T |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
Product Detail
| Means of Transport: | Ocean, Air, Land |
|---|
Product Description
Specical for bga,lead soldering balls 0.25-0.76mm,25W grain one bottle