Diamond Dicing Blades for agate cutting diamond hacksaw blade for glass cutting
| Min. Order: | 1 Piece/Pieces |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | L/C, T/T |
| Supply Ability: | 4000/months |
| Place of Origin: | Henan |
Company Profile
| Location: | Zhengzhou, Henan, China (Mainland) |
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| Business Type: | Manufacturer, Trading Company |
Product Detail
| Model No.: | cutting blade |
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| Means of Transport: | Ocean, Air, Land |
| Brand Name: | More super hard |
| Material: | Diamond |
| Usage: | For Woodworking Tools |
| Abrasive Grain Sizes: | 120 240# 500# |
| Workpiece: | carbide teeth |
| Production Capacity: | 4000/months |
| Packing: | carton box |
| Delivery Date: | 5-10days |
Product Description
Diamond Dicing Blades
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry.
The Type: diamond hub dicing blade and diamond hubless dicing blade
Electroformed dicing blade | Features: Easy to handle ultra-thin blade; Blade dicing after laser grooving; Variety of different grit concentrations; Shows stable processing performance in high load processing | Hub dicing blade |
Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) | ||
resin dicing blade | Features: High processing quality for cutting of hard, brittle materiais; Able to precisely control diamond concentration to achieve cutting quality; Improved cut quality on hard materials |
Hubless dicing blade |
Application: Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter | ||
metal dicing balde | Features: High rigidityminimized wavy and slant cutti g ; Able to control diamond concentration to achieve cutting quality ;Excellent rigidit and cut quality | |
Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, | ||
Electroformed dicing balde | Features: Wide selection of blade options; Proprietary thin-blade technology ;Blade thickness - 0.0 15 mm to 0.3 mm; Available for both dicing saws and slicers | |
Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon | ||
Other specification can be produced according to customers requirements | ||
Feature:
1.Minimized blade wear and high cutting ability.
2. High rigidity-minimized wavy and slant cutting.
3. Able to precisely control diamond concentration to achieve cutting quality.
4. Excellent rigidity, high wear resistance, long life and low risk of wavy cutting.