Place of Origin: | Zhejiang |
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Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Model No.: | BIC-495151-V2 |
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Security System Blind Via 12 Layer Printed Cirucit Board 2.0mm With Green Mask
PCB parameters
PCB SIZE | 257 x 171.5mm=1PCS=1design |
BOARD TYPE | |
Number of Layers | Multilayer PCB, 12 Layer PCB |
Surface Mount Components | YES |
Through Hole Components | YES |
LAYER STACKUP | copper ------- TOP 17um(1oz)+plate 25um |
130 um prepreg 1080 x 2 | |
copper ------- L02 35um(1oz) | |
150um core FR-4 | |
copper ------- L03 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L04 35um(1oz) | |
150um core FR-4 | |
copper ------- L05 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L06 35um(1oz) | |
150um core FR-4 | |
copper ------- L07 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L08 35um(1oz) | |
150um core FR-4 | |
copper ------- L09 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- L10 35um(1oz) | |
150um core FR-4 | |
copper ------- L11 35um(1oz) | |
130 um prepreg 1080 x 2 | |
copper ------- BOT 17um(0.5oz)+plate 25um | |
TECHNOLOGY | |
Minimum Trace and Space: | 4mil/4mil |
Minmum / Maximum Holes: | 0.25/3.0mm |
Number of Different Holes: | 26 |
Number of Drill Holes: | 4013 |
Number of Milled Slots: | 0 |
Number of Internal Cutouts: | 0 |
Impedance Control | Differential pairs impedance controll |
BOARD MATERIAL | |
Glass Epoxy: | FR-4, ITEQ IT-140, TG>135, er<5.4 |
Final foil external: | 1oz |
Final foil internal: | 1oz |
Final height of PCB: | 2.0mm ±10% |
PLATING AND COATING | |
Surface Finish | Immersion Gold (ENIG)( 2 µ" over 100 µ" nickel) |
Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
Solder Mask Color: | Green, PSR-2000GT600D, Taiyo supplied. |
Solder Mask Type: | LPSM |
CONTOUR/CUTTING | Routing |
MARKING | |
Side of Component Legend | TOP |
Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
VIA | Plated Through Hole(PTH), Blind via top to inner layer 2, via tented. Vin in pad under BGA package |
FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
DIMENSION TOLERANCE | |
Outline dimension: | 0.0059" (0.15mm) |
Board plating: | 0.0030" (0.076mm) |
Drill tolerance: | 0.002" (0.05mm) |
TEST | 100% Electrical Test prior shipment |
APPLICATION: | Surveillance Systems |
TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
SERVICE AREA | Worldwide, Globally. |
Advantages
a) Epoxy glass FR-4 Tg135. oHS compliant and suitable for thermal reliability needs,and Lead free assemblies with a maximum reflow temperature of 260.
b) Immersion gold PCB. Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) ISO certified PCB manufacturing factory.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
e) DDU Door to door shipment with competitive shipping cost.
More Applications in Electronics
Security System
Mobile Signal Booster
Wireless Surveillance System
Video Surveillance System
Embedded System
Industrial Automation
Bicheng MCPCB Capability
NO. | Parameter | Value |
1 | Type of Metal Core | Aluminum, Copper, Iron |
2 | Model of Metal Core | A1100, A5052, A6061, A6063, C1100 |
3 | Surface Finish | HASL, Immersion Gold, Immersion Silver, OSP |
4 | Thickness of Surface plating | HASL: Sn>2.54µm, ENIG: Au 0.025-0.1µm, Ni 2.5-5µm |
5 | Layer Count | 1-4 Layers |
6 | Maximum of Board Size | 23" x 46" (584mm×1168mm) |
7 | Mininum of Board Size | 0.1969" x 0.1969" (5mm×5
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