High Frequency High Speed PCB Double Layer PTFE F4B In 4 Way Divider
PCB properties
| PCB SIZE | 89 x 61mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB |
| Surface Mount Components | NO |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 18um(0.5oz)+PLATE |
| PTFE 1.5mm |
| copper ------- 18um(0.5oz)+PLATE |
| TECHNOLOGY | |
| Minimum Trace and Space: | 6mil/9mil |
| Minmum / Maximum Holes: | 0.9/2.3mm |
| Number of Different Holes: | 3 |
| Number of Drill Holes: | 156 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 1 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | PTFE ER= 2.55 |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | OSP, Thickness >0.2µm |
| Solder Mask Apply To: | TOP, 12micron Minimum |
| Solder Mask Color: | Gloss Green, Taiyo PSR-2000GT600D |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | No silkscreen required. |
| Colour of Component Legend | No silkscreen required. |
| Manufacturer Name or Logo: | No silkscreen required. |
| VIA | Plated through hole(PTH), via open. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | 4 Way divider |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally.
|
Advantages
a) PTFE substrate. Good high temperature and low temperature resistance.(-192-260)
b) Superior corrosion resistance. No corrosion in acids, alkali and aqua regia.
c) No minimum order quantity. 1-10 pieces are offered for sale.
d) ISO certified PCB manufacturing factory.
e) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
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PC104
PCB knowledge: The components of multilayer PCB --- Prepreg
A multilayer board consists of copper foils, thin rigid laminates and prepreg sheets.
Prepreg plays a role of bonding material used for bonding the individual thin laminates of the multilayer boards. It consists of glass cloth impregnated with epoxy resin. Unlike rigid laminates, the epoxy resin is only semi-cured. Epoxy resin is referred to as B-stage when semi-cured.
The prepreg sheets are not sticky. During lamination of the board, the epoxy resin is first changed to a liquid state and later in the press cycle to the fully cured state. During the press cycle, the cured epoxy resin in the thin, rigid laminates softens, but it does not become liquid.
Thicknesses of Prepreg sheets
| Glass Fabric Style | Pressed Thickness | Resin Content |
| mm | mil | % |
| 7628H(7630) | 0.213 | 8.4 | 50 |
| 7628(43%) | 0.195 | 7.6 | 43 |
| 7628(41%) | 0.185 | 7.3 | 41 |
| 2116HR | 0.135 | 5.3 | 57 |
| 2116 | 0.12 | 4.7 | 52 |
| 2113 | 0.1 | 4 | 56 |
| 1080 | 0.076 | 3 | 64 |
| 1060 | 0.05 | 2 | 71 |
The pressed thickness varies from one manufacturer to another. As long as the PCB designer does not know the brand(s) of the glass fabrics used by the multilayer board manufacturer, it is more or less impossible to specify a detailed build-up. Therefore, this should be left to the manufacturer.
When a board is required impedance control, the thickness of the dielectric material between the individual layers become important and thickness and tolerance are usually specified by designer.
The minimum thickness of the dielectric material (thin laminate or prepreg sheets) is 75 µm (3 mils) and, in some cases, 100 µm (4 mils).
Reference: 12 layers 2.0mm thick Build up
(This is reference layer stackup. The stackup of multilayer PCB’s can be reached in many different ways.)
FAQ
Do you sell rigid-flex PCB?
Sorry. We currently do not offer rigid-flex PCB.
