user login

FR4 ER5.4 Blind Via PCB 4 Layer Immersion Gold For Bluetooth Receiver

Place of Origin: Zhejiang

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer

Product Detail

Model No.: BIC-089472-3C

Product Description

FR4 ER5.4 Blind Via PCB 4 Layer Immersion Gold For Bluetooth Receiver

 

PCB parameters

PCB SIZE 150 x 160mm=20PCS
BOARD TYPE
Number of Layers Multilayer, 4 layer PCB
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5oz)+plate TOP layer
Prepreg 1x2133 + 1x1080 + 1x2116 0.29mm
copper ------- 17um(0.5oz) MidLayer 1
FR-4 0.89mm
copper ------- 17um(0.5oz) MidLayer 2
Prepreg 1x2133 + 1x1080 + 1x2116 0.29mm
copper ------- 17um(0.5oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 3.9mil/6.1mil
Minmum / Maximum Holes: 0.3/0.72mm
Number of Different Holes: 10
Number of Drill Holes: 851
Number of Milled Slots: 36
Number of Internal Cutouts: 0
Impedance Control no
BOARD MATERIAL
Glass Epoxy: ITEQ IT140 TG>135, er<5.4
Final foil external: 1oz
Final foil internal: 1oz
Final height of PCB: 1.6mm ±0.16
PLATING AND COATING
Surface Finish Immersion gold 0.025µm over 3µm Nickel
Solder Mask Apply To: TOP and Bottom, 12micron Minimum
Solder Mask Color: Gloss Green, Taiyo PSR-2000GT600D
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend TOP
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), Blind via L1-L2
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
APPLICATION: Bluetooth receiver
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

Advantages

a) FR-4 UL94V0 material. RoHS compliant and suitable for thermal reliability needs,and Lead free assemblies with a maximum reflow temperature of 260.

b) Immersion gold PCB. High solderability, no stressing of circuit boards and less contamination of PCB surface.

c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.

d) ISO certified PCB manufacturing factory.
e) Delivery on time. We keep higher than 95% on-time-delivery rate.

 

 

More Applications in Electronics

Wireless Hub
Wifi 3G
Wifi Booster Antenna
USB Wlan Adapter
AC To DC Adapter

 

 

Design for Manufacture (1)

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m²) Middle volume (S<10 m²) Prototype(S<1m²)
1 Inner layer (18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
Post Buying Request