FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration
| Place of Origin: | Zhejiang |
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Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
Product Detail
| Model No.: | BIC-1516-VER2.2 |
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Product Description
FR 4 High Tg PCB Red Solder Mask 3 Microinch Gold For System Integration
PCB Data Sheets
| PCB SIZE | 160 x 260mm=3PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 4 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP layer |
| Prepreg 7628 0.195mm | |
| copper ------- 18um(0.5oz) MidLayer 1 | |
| FR-4 1.0mm | |
| copper ------- 18um(0.5oz) MidLayer 2 | |
| Prepreg 7628 0.195mm | |
| copper ------- 35um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.9mil/7.4mil |
| Minmum / Maximum Holes: | 0.787/5.0mm |
| Number of Different Holes: | 12 |
| Number of Drill Holes: | 3250 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | no |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180 TG>170, er<5.4 |
| Final foil external: | 1.5oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (33.4%) 3 micoinch over 100 microinch nickle |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Red |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | System integration |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260
b) Excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
c) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
d) No minimum order quantity. 1-10 pieces are offered for sale.
More Applications in Electronics
Gateway
Rfid
Inverter
Antenna
Wifi Booster
Contract Manufacturing Services
Low Cost Plc
Embedded Systems Development
Embedded Computer Systems
Ac Power Supplies
IT-180 Data Sheets (Properties)
| ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS | ||||||
| IPC-4101C Spec / 99 / 101 / 126 | ||||||
| LAMINATE( IT-180ATC) | ||||||
| Property | Thickness<0.50 mm | Thickness0.50 mm | Units | Test Method | ||
| [0.0197 in] | [0.0197 in] | |||||
| Typical Value | Spec | Typical Value | Spec | Metric | IPC-TM-650 | |
| (English) | (or as noted) | |||||
| Peel Strength, minimum | N/mm | 2.4.8 | ||||
| A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil] | (lb/inch) | 2.4.8.2 | ||||
| B. Standard profile copper foil | 0.88 (5.0) | 0.70 (4.00) | 0.88 (5.0) | 0.70 (4.00) | 2.4.8.3 | |
| 1. After Thermal Stress | ||||||
| 2. At 125°C [257 F] | ||||||
| 3. After Process Solutions |
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