Three Zone Cold and Hot Thermal Shock Chamber for Temperature Impact

Three Zone Cold and Hot Thermal Shock Chamber for Temperature Impact

Product description: 

Cold and hot chamber consists of two separately controlled hot and cold zones with product being transferred between these zones for rapid product temperature changes. It is used to test the changes in physical of the electronic chip IC, PCB, semiconductor ceramic and polymer materials, and composite material and material structure’s result which under continuous environment with high temperature or low temperature shock in short time. It means this product can test the material’s chemical change or physics change by expansion and contraction within short time. 

Features: 

Cold and hot chamber is divided into three zones: the high temperature zone, the low temperature zone and test zone.

1. LCD touch panel controller can display Chinese / English. Big size TFT LCD  panels are also adopted.
2. High formula memory capacity can be set to 120 patterns. The maximum cycle setting is 9999 times. The maximum setting of each section is 999 Hrs 59 Mins.
3. Equipped with RS-232C communication interface device, capable of controlling / editing/ recording in the linkage with the computer and two set dynamic connection point and convenient application.
4. Both 2 zone and 3 zone shocks can be chosen.
5. All equipments are fully automatic, and all process are precisely controlled with PLC.
6. If any parts have errors, the machine will automatically shuts down and a warning light switches on.
7. Machine can be shut down automatically in case of electrical power instabilities.
 

Technical parameters: