Standard black / red PCB Copper Foil for printed circuit board
| Place of Origin: | Guangdong |
|---|
Company Profile
| Location: | Shanghai, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | RA Copper Foil |
Product Detail
| Model No.: | AIA-1 |
|---|
Product Description
ED Red Copper Foil For FPC , Maximum Width 600mm In Roll Size
Specification:
Material: T2 Red Copper
Desnity:8.9g/cm3
Cu Purity:≥99.8%
Dimension Range:
Thickness: 9µm35µm
Width:550mm~1295mm
Performances:
The product surface is black or red, has lower surface roughness.
Applications:
Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.
Features:
High density, high bending resistance and good etching performance.
Microstructure:
Table1- Performance:
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
|
|
Cu Content |
% |
≥99.8 |
||||
|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
|
|
Tensile Strength |
R.T.(23) |
Kg/mm2 |
≥28 |
|||
|
H.T.(180) |
≥15 |
≥15 |
≥15 |
≥18 |
||
|
Elongation |
R.T.(23) |
% |
≥5.0 |
≥5.0 |
≥6.0 |
≥10 |
|
H.T.(180) |
≥6.0 |
≥6.0 |
≥8.0 |
≥8.0 |
||
|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
|||
|
Matte(Rz) |
≤2.5 |
|||||
|
Peel Strength |
R.T.(23) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.8 |
≥0.8 |
|
Degraded rate of HCΦ(18%-1hr/25) |
% |
≤7.0 |
||||
|
Change of color(E-1.0hr/200) |
% |
Good |
||||
|
Solder Floating 290 |
Sec. |
≥20 |
||||
|
Appearance(Spot and copper powder) |
---- |
None |
||||
|
Pinhole |
EA |
Zero |
||||
|
Size Tolerance |
Width |
mm |
0~2mm |
|||
|
Length |
mm |
---- |
||||
|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
||||
Product Photo
Application
Why Choose us Civen as your supplier?
1. Good reputation in Cu fields.
2. Full Experience on cooperatrate with the world's leading large enterprises, such as Samsung, BYD
3. With certificate ISO,ROHS,CTI and SGS.
4. Delivery on time.
5. Perfect quality of the goods wuth all the mill certificate.
6. Good communication skill,good service for understanding your requirements.
7. Strong sea-worthy package.