Large Dimension ED Copper Shielding Foil For EMI / EMC Shield Room
| Place of Origin: | Guangdong |
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Company Profile
| Location: | Shanghai, China (Mainland) |
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| Business Type: | Manufacturer |
| Main Products: | RA Copper Foil |
Product Detail
| Model No.: | AIA-1 |
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Product Description
Large Dimension ED Copper Foils For EMI Or EMC Shielding Room
Specification:
Copper Foil Tape For EMI Shielding
Conductive Copper Foil Adhesive Tape
Backing Material: Copper foil
Backing thickness: 9mic~105mic
heisive: Acrylic Conducitve Glue
Width: Max.1290mm
It is widely used as EMI shielding material on Laptop, PC, Cell, and other electronic industry
Performance:
|
Classification |
Unit |
9μm |
12μm |
18μm |
35μm |
50μm |
70μm |
105μm |
|
|
Cu Content |
% |
≥99.8 |
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|
Area Weigth |
g/m2 |
80±3 |
107±3 |
153±5 |
283±7 |
440±8 |
585±10 |
875±15 |
|
|
Tensile Strength |
R.T.(23) |
Kg/mm2 |
≥28 |
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|
H.T.(180) |
≥15 |
≥18 |
≥20 |
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|
Elongation |
R.T.(23) |
% |
≥5.0 |
≥6.0 |
≥10 |
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|
H.T.(180) |
≥6.0 |
≥8.0 |
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|
Roughness |
Shiny(Ra) |
μm |
≤0.43 |
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|
Matte(Rz) |
≤3.5 |
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|
Peel Strength |
R.T.(23) |
Kg/cm |
≥0.77 |
≥0.8 |
≥0.9 |
≥1.0 |
≥1.0 |
≥1.5 |
≥2.0 |
|
Degraded rate of HCΦ(18%-1hr/25) |
% |
≤7.0 |
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|
Change of color(E-1.0hr/200) |
% |
Good |
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|
Solder Floating 290 |
Sec. |
≥20 |
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|
Appearance(Spot and copper powder) |
---- |
None |
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|
Pinhole |
EA |
Zero |
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|
Size Tolerance |
Width |
0~2mm |
0~2mm |
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|
Length |
---- |
---- |
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|
Core |
Mm/inch |
Inside Diameter 79mm/3 inch |
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Why Choose us Civen as your supplier?
1. Good reputation in Cu fields.
2. Full Experience on cooperatrate with the world's leading large enterprises, such as Samsung, BYD
3. With certificate ISO,ROHS,CTI and SGS.
4. Delivery on time.
5. Perfect quality of the goods wuth all the mill certificate.
6. Good communication skill,good service for understanding your requirements.
7. Strong sea-worthy package.