Min. Order: | 500 Piece/Pieces |
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Trade Term: | FOB,CFR,CIF,DAT,FAS,DDP,DAP,CIP,CPT,FCA,EXW,DDU |
Payment Terms: | Paypal, L/C, D/P, D/A, T/T, WU, Money Gram |
Supply Ability: | 50000pcs/monthly |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB Products, Which Includs Double Layers PCB, Multilayer PCB, Aluminium PCB (Metal Core PCB) Flexible PCB (FPCB), Rigid |
Means of Transport: | Ocean, Air, Land |
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Number of Layers: | Others |
Brand Name: | Hitech PCB |
Base Material: | FR4, Tg150 |
Copper Thickness: | 17.5um (Hoz) for all layers |
Board Thickness: | 1.0mm |
Multilayer PCB: | Multi-layer pcb |
HDI PCB: | High density PCB |
High Density Interconnect PCB: | Metal Base PCB |
Aluminium PCB: | Flexible PCB |
rigid-flex PCB: | Flex-rigid PCB |
Impedance Control PCB: | Quick turn pcb |
Express PCB prototype: | High Frequency PCB |
Heavy Copper Power PCB: | China PCBA |
PCB Assembly: | China PCB manufacturer |
PCB board: | PCB board |
Production Capacity: | 50000pcs/monthly |
Packing: | As request |
Delivery Date: | 2-10 days |
10L High density PCB (HDI PCB)
Layer Count: 10-layers (HDI PCB with3+4+3 stack up)
Mobile Phone main board
Finish board thickness: 1.0mm
Material: FR4, Tg150
Surface finishing: immersion gold+OSP
Line width and space: 0.13/0.13mm
Special technology: HDI PCB with 3 + 4 + 3 Layers, 4mil Blind and 12mil Buried Via
Impedance control tolerance: +/-8%
Through hold size: 0.3mm