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High Density Interconnect PCB

Min. Order: 500 Piece/Pieces
Trade Term: FOB,CFR,CIF,DAT,FAS,DDP,DAP,CIP,CPT,FCA,EXW,DDU
Payment Terms: Paypal, L/C, D/P, D/A, T/T, WU, Money Gram
Supply Ability: 50000pcs/monthly
Place of Origin: Guangdong

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer
Main Products: PCB Products, Which Includs Double Layers PCB, Multilayer PCB, Aluminium PCB (Metal Core PCB) Flexible PCB (FPCB), Rigid

Product Detail

Means of Transport: Ocean, Air, Land
Number of Layers: Others
Brand Name: Hitech PCB
Base Material: FR4, Tg150
Copper Thickness: 17.5um (Hoz) for all layers
Board Thickness: 1.0mm
Multilayer PCB: Multi-layer pcb
HDI PCB: High density PCB
High Density Interconnect PCB: Metal Base PCB
Aluminium PCB: Flexible PCB
rigid-flex PCB: Flex-rigid PCB
Impedance Control PCB: Quick turn pcb
Express PCB prototype: High Frequency PCB
Heavy Copper Power PCB: China PCBA
PCB Assembly: China PCB manufacturer
PCB board: PCB board
Production Capacity: 50000pcs/monthly
Packing: As request
Delivery Date: 2-10 days
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Product Description

10L High density PCB (HDI PCB)

Layer Count: 10-layers (HDI PCB with3+4+3 stack up)

Mobile Phone main board

Finish board thickness: 1.0mm

Material: FR4, Tg150

Surface finishing: immersion gold+OSP

Line width and space: 0.13/0.13mm

Special technology: HDI PCB with 3 + 4 + 3 Layers, 4mil Blind and 12mil Buried Via

Impedance control tolerance: +/-8%

Through hold size: 0.3mm      


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