Place of Origin: | Guangdong |
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Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | Clean Room ESD, Clean Room Wipes, Cleanroom Paper |
Model No.: | AIA-1 |
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1/2 inch High Temperature Polyimide Masking ESD Tape Gold Finger Protector
1.High temperature resistant
2.Protect gold finger during wave solder
3.ESD function
4.customer size
1. kapton tape is made of high temperature HN series polyimide film.
2.This Polyimide tape is used in masking of circuit boards during wave soldering or other electronic manufacturing
processes. It can be used in powder coating, automotive and transformer manufacturing.
3. It has high dielectric strength. Kapton masking tape, offers excellent performance in electrical and thermal
insulation.
4. This Kapton tape is made of 1 Mil Polyimide material with 1.5 mil of silicon adhesive which does not leave any
residue. It can withstand temperature up to 380°C.. It is packaged in 3" core and is 36 yards long.
5. Kapton Tape Applications: Electrical Insulation, Gold leaf mask of printed circuit boards during wave soldering,
transformer and capacitor insulation, powder coating and high temperature applications.
Physical Properties
Adhesive Type: | Silicone |
Backing Thickness (mm): | 0.025 |
Total Thickness (mm): | 0, 065 |
Peel Strength (N/cm): | 6 |
Tensile Strength (N/cm): | 53 N/10mm |
Elongation (%): | 50 |
Temperature Range: | Continuous 180 short periods up to 380° |
Chemical Properties
PH value of aqueous extract: | 4.0 - 6.0 |
Freedom from corrosive sulphur: | No stain on copper |
Storage & Application
Storage: | The conditions under which this product is stored may affect its performance. Storage should be in dry, well ventilated rooms with a constitute temperature of around 20° C and should be protected from continuous exposure to direct sunlight. |
Method of Application: | The product should always be applied to clean, dry, surfaces |
Inspection report |
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Produce name |
P84-polyimide high tempreature adhesive tape |
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Produce No. |
YH-PFT** |
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ITME |
UNIT |
SPEC |
TEST METHOD |
Total Thickness |
Mm |
0.06mm±0.01mm |
GB7125-1999 |
Substrate thickness |
Mm |
0.25mm±0.01mm |
GB7125-1999 |
Adhesion |
N/25mm |
6.5 |
GB/T72792-1998 |
Tensile Strength |
N/25mm |
115 |
GB7753-1987 |
Elongation |
% |
55 |
GB7753-1987 |
Breakdown voltage |
KV |
5.5 |
GB7753-1987 |
Insulation levels |
--- |
H |
GB7753-1987 |
Heat Resistance |
|
-73--+286 |
GB/T72792-1998 |
Length |
M |
33 |
|
Color |
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Tawny |
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USAGES: For use with welding protection, winding insulation strapping high temperature; PCB gold finger high-temperature spraying covered protection, handset lithium battery manufacturing banding. |
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FEATURES: Good performance in adhesive force,high temperaturer resistant,solvent resistance, strong holding force,no residual adhesiv leleft.
1. Subst
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