High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK

High Transmittance Low Temperature Conductive Adhesive Glue 0.3W / mK

TIS™ 280-03AB is a two-component,high transmittance, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue.This potting glue to apply on LED chip seal, LED ligh bar,and for any king of LED lighting porer or substrate cure.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

>  Good thermal conductive: 0.3W/mK
>  Excellent insulation and smoothly sourface.
>  Low shrinkage
>  Low viscosity, expediting air releaseed.
>  Excellent in solvents and water proof. 
>  Longer life time.
>  Excellent thermal shock efficiecy and impact resistance

Application  

>  To potting LED Lighting heat spreader and  power- driver.
>  Ferrite cements; tip type LED; good cementation to aromatic polyester 
>  Relay sealant; Good adhesion to rubber, ceramics,  PCB and plastics 
>  Power transformers and coils; Potting capacitors;  Potting of small electrical devices 
>  Adhesion to metal glass and plastic; LCD & substrates adhesion; Coating and sealant;  Coil ; IGBTS; Transformer; Fire retardant 
>  Optical / medical component adhesive