High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling
| Place of Origin: | Guangdong |
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Company Profile
| Location: | Dongguan, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
| Main Products: | Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler |
Product Detail
| Model No.: | AIA-1 |
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Product Description
High Thermal Conductivity Heat Dissipation Thermal Paste for CPU Heatsink Cooling
Applications lnclude
> LED lighting
> Semiconductor cases and heat sinks
> Power resistors and chassis, thermostats and mating surfaces, and thermoelectric cooling devices
> CPU's and GPU's
> Automatic dispensing and screen-printing
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Typical Properties of TIG™780-30 Series |
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| ProductName | TIG™780-30 | Test Method |
| Color | Gray | Visual |
| Construction & Compostion |
Metal oxide filled silicone oil | |
| Viscosity | 1800K cps @.25 | Brookfield RVF,#7 |
| Specific Gravity | 2.5 g/cm3 | |
| Continuous Use Temp | -49 to 392 / -45 to 200 | ***** |
| Evaporation |
0.15% / 200@24hrs
|
***** |
| Thermal Conductivity | 3.0 W/mK | ASTM D5470 |
| Thermal lmpedance | 0.04-in²/W @ 50 psi(344 KPa) | ASTM D5469 |
Package:
TIG™780 Series is available in 1kg(pint container),3kg(quart container),and 10kg(gallon container)or custom packaged in syringes for automated applications.
