Place of Origin: | Guangdong |
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Location: | Dongguan, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler |
Model No.: | AIA-1 |
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LED Heat Sink Aluminum Foil Adhesive Tape with High Thermal Conductivity 1.6 W /mK
The TIA™800FG Series products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing.
Features
> Thermal Conductivity: 1.6 W/mK
> High bond strength to a variety of surfaces double sided pressure sensitive adhesive tape
> High performance, thermally conductive acrylic adhesive
Applications
> Mount heat sink onto BGA graphic processor or drive processor
> Mount heat spreader onto power converter PCB or onto motor control PCB
> High performance, thermally conductive acrylic adhesive
> Can be used instead of heat cure adhesive,screw mounting or clip mounting
Typical Properties of TIA™800AL Series | ||
Typical Properties | TIA 806AL | Test Method |
Color | White | Visual |
Adhesive Type | Acrylic Adhesive | ******** |
Backing Type | Aluminum Foil | ******** |
Composite Thickness | 0.004" / 0.102mm | ASTM D374 |
Aluminum Foil Thickness | 0.002" / 0.05mm | ASTM D374 |
Total Thickness | 0.006" / 0.152mm | ASTM D374 |
Thickness Tolerance | ±0.001" / ±0.025mm | ASTM D374 |
Voltage Breakdown | > 1000 Vac | ASTM D149 |
Peel Adhesion | 1200 g/inch | JIS K02378 |
Holding Power 25/Days | > 120 kg/inch2 | JIS K023711 |
Holding Power 120/Hours | > 10 kg/inch2 | JIS K023711 |
Recommend Using Pressure | 10 psi | ******** |
Thermal Conductivity | 1.6 W/mK | ASTM D5470 |
ThermalImpedance@50psi | 0.43 -in²/W | ASTM D5470 |