Place of Origin: | Guangdong |
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Location: | Dongguan, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | Phase Changing Materials, Thermal Conductive Pad, Thermal Gap Filler |
Model No.: | AIA-1 |
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No Need Preheating Pink Thermal Phase Change Interface Material For Notebook
The TIC™800P Series is low melting point thermal interface material. At 50, The TIC™800P Series begins to soften and flow, filling the microscopic irregularities of both the thermal solution and the integrated circuit package surface, thereby reducing thermal resistance.The TIC™800Y Series is a flexible solid at room temperature and freestanding without reinforcing components that reduce thermal performance.
The TIC™800P Series shows no thermal performance degradation after 1,000 hours@130,or after 500 cycles, from -25 to 125.The material softens and does not fully change state resulting in minimal migration (pump out)at operating temperatures.
Features:
> 0.024-in² /W thermal resistance
> Naturally tacky at room temperature, no adhesive required
> No heat sink preheating required
Applications:
> High Frequency Microprocessors
> Notebook and Desktop PCs
> Computer Serves
> Memory Modules
> Cache Chips
> IGBTs
Typical Properties of TIC™800P Series | |||||
Product Name
|
TICTM803P
|
TICTM805P
|
TICTM808P
|
TICTM810P
|
Testing standards
|
Color
|
Pink |
Pink
|
Pink | Pink |
Visual
|
Composite Thickness
|
0.003"
(0.076mm) |
0.005"
(0.126mm) |
0.008"
(0.203mm) |
0.010"
(0.254mm) |
|
Thickness Tolerance
|
±0.0006"
(±0.016mm) |
±0.0008"
(±0.019mm) |
±0.0008"
(±0.019mm) |
±0.0012"
(±0.030mm) |
|
Density
|
2.2g/cc
|
Helium Pycnometer
|
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Work temperature
|
-25125
|
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phase transition temperature
|
50~60
|
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Setting temperature
|
70 for 5 minutes
|
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Thermal conductivity
|
0.95 W/mK
|
ASTM D5470 (modified)
|
|||
Thermal lmpedance @ 50 psi(345 KPa)
|
0.021-in²/W
|
0.024-in²/W
|
0.053-in²/W
|
0.080-in²/W
|
ASTM D5470 (modified)
|
0.14-cm²/W
|
0.15-cm²/W
|
0.34-cm²/W
|
0.52-cm²/W
|