8 Layer TG130 High TG PCB for LED Lighting Copper Based Metal Core PCB Circuit Board
| Place of Origin: | Zhejiang |
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Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
| Main Products: | Multilayer PCB, Fr4 PCB, High Frequency PCB |
Product Detail
| Model No.: | XCEH |
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Product Description
8 Layer TG130 High TG PCB LED Copper Based Metal Core Circuit Board
Specification:
| Size: 5*3 cm | Board THK: 1.2MM |
| Copper THK: 1OZ | Origin: China |
| Model: XCEH | Brand: XCE |
Description:
Tg is Glass Transition Temperature. As flammability of board is V-0 (UL 94-V0), so if the temperature exceeds designated
tg value, the board will changed from glassy state to rubbery state and then the function of board will be affected.
High TG materials have better mechanical strength, dimension stability, adhesiveness, moisture absorption, thermal decomposition,
and thermal expansion than normal TG pcbs.
High Tg material (TG170) is also popular in LED lighitng industry, because heat dissipation of LED is higher than normal electronic
components, however same structure of FR4 board is much cheaper than that of metral core pcbs, like aluminum board.
Parameter:
High precision prototype | PCB bulk production | ||
Max Layers | 1-28 layers | 1-14 layers | |
MIN Line width(mil) | 3mil | 4mil | |
MIN Line space(mil) | 3mil | 4mil | |
Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
Board thickness≤2.5mm | 0.2mm | 0.3mm | |
Board thickness2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
Board thickness | MAX | 8mm | 7mm |
MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
MAX Board size | 610*1200mm | 610*1200mm | |
Max copper thickness | 0.5-6oz | 0.5-6oz | |
Immersion Gold/ | Immersion Gold:Au,1—8u” | ||
Hole copper thick | 25um 1mil | 25um 1mil | |
Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm | Board thickness≤1.0mm:+/-0.1mm |
Outline Tolerance | ≤100mm:+/-0.1mm | ≤100mm:+/-0.13mm | |
Impedance | ±10% | ±10% | |
MIN Solder mask bridge | 0.08mm | 0.10mm | |
Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |